Inventor · disambiguated record
Masamichi Ishihara
Also filed as: ISHIHARA MASAMICHI
72 granted patents·2 pending applications·1,790 citations·filing 1976–2020
99Inventor score
Files withHITACHI LTD39ISHIHARA MASAMICHI9LAPIS SEMICONDUCTOR CO LTD6KYUSHU INST TECHNOLOGY4NGK INSULATORS LTD4
Top patents by PatentIndex Score
74 records- 0198US7808093B2Stacked semiconductor deviceELPIDA MEMORY INC·Filed 2007·Granted Oct 5, 2010·117 cites·21 claims
- 0295US7944058B2Semiconductor device and process for fabricating the sameOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted May 17, 2011·25 cites·27 claims
- 0394US8017452B2Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said methodKYUSHU INST TECHNOLOGY·Filed 2008·Granted Sep 13, 2011·42 cites·20 claims
- 0494US5332922AMulti-chip semiconductor packageHITACHI LTD·Filed 1991·Granted Jul 26, 1994·158 cites·16 claims
- 0593US5021998ASemiconductor memory device with low-house pads for electron beam testHITACHI LTD·Filed 1989·Granted Jun 4, 1991·88 cites·15 claims
- 0691US9559041B2Semiconductor device and process for fabricating the sameLAPIS SEMICONDUCTOR CO LTD·Filed 2015·Granted Jan 31, 2017·5 cites·4 claims
- 0791US5208782ASemiconductor integrated circuit device having a plurality of memory blocks and a lead on chip (LOC) arrangementHITACHI LTD·Filed 1992·Granted May 4, 1993·133 cites·28 claims
- 0891US4562555ASemiconductor memory deviceHITACHI LTD·Filed 1983·Granted Dec 31, 1985·59 cites·35 claims
- 0990US10559521B2Semiconductor device and process for fabricating the sameLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Granted Feb 11, 2020·3 cites·10 claims
- 1090US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 1188US8557700B2Method for manufacturing a chip-size double side connection packageISHIHARA MASAMICHI·Filed 2009·Granted Oct 15, 2013·12 cites·4 claims
- 1288US7884466B2Semiconductor device with double-sided electrode structure and its manufacturing methodOKI ELECTRIC IND CO LTD·Filed 2007·Granted Feb 8, 2011·15 cites·10 claims
- 1387US5910010ASemiconductor integrated circuit device, and process and apparatus for manufacturing the sameHITACHI LTD·Filed 1995·Granted Jun 8, 1999·112 cites·11 claims
- 1486US9984961B2Chip-size, double side connection package and method for manufacturing the sameINVENSAS CORP·Filed 2013·Granted May 29, 2018·6 cites·13 claims
- 1585US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 1685US4819213ASemiconductor memoryHITACHI LTD·Filed 1986·Granted Apr 4, 1989·47 cites·28 claims
- 1782US5701031ASealed stacked arrangement of semiconductor devicesHITACHI LTD·Filed 1994·Granted Dec 23, 1997·58 cites·16 claims
- 1881US5410507ASpecial mode control method for dynamic random access memoryHITACHI LTD·Filed 1992·Granted Apr 25, 1995·50 cites·50 claims
- 1981US4951122AResin-encapsulated semiconductor deviceHITACHI LTD·Filed 1988·Granted Aug 21, 1990·54 cites·35 claims
- 2079US6108264ADynamic type semiconductor memory deviceHITACHI LTD·Filed 1999·Granted Aug 22, 2000·34 cites·17 claims
- 2178US8247896B2Stacked semiconductor device and fabrication method for sameKAGAYA YUTAKA·Filed 2010·Granted Aug 21, 2012·4 cites·17 claims
- 2276US9812621B2Semiconductor device and fabrication method for sameISHIHARA MASAMICHI·Filed 2012·Granted Nov 7, 2017·5 cites·14 claims
- 2376US8110911B2Semiconductor chip package with post electrodesISHIHARA MASAMICHI·Filed 2009·Granted Feb 7, 2012·7 cites·13 claims
- 2476US5276346ASemiconductor integrated circuit device having protective/output elements and internal circuitsHITACHI LTD·Filed 1992·Granted Jan 4, 1994·29 cites·4 claims
- 2576US4991139ASemiconductor memory deviceHITACHI LTD·Filed 1988·Granted Feb 5, 1991·30 cites·12 claims
- 2675US5610089AMethod of fabrication of semiconductor integrated circuit deviceHITACHI LTD·Filed 1995·Granted Mar 11, 1997·40 cites·19 claims
- 2774US4802135ASemiconductor memory having multiple continuous access functionsHITACHI LTD·Filed 1986·Granted Jan 31, 1989·30 cites·10 claims
- 2873US11127657B2Semiconductor device and process for fabricating the sameLAPIS SEMICONDUCTOR CO LTD·Filed 2020·Granted Sep 21, 2021·0 cites·10 claims
- 2973US4858190ADual port semiconductor memory having random and serial access modesHITACHI LTD·Filed 1987·Granted Aug 15, 1989·34 cites·29 claims
- 3072US9698327B2LED illumination module and LED illumination apparatusSHIKOKU INSTR CO LTD·Filed 2013·Granted Jul 4, 2017·3 cites·22 claims
- 3171US7576413B2Packaged stacked semiconductor device and method for manufacturing the sameKYUSHU INST TECHNOLOGY·Filed 2005·Granted Aug 18, 2009·5 cites·24 claims
- 3269US5719815ASemiconductor memory having a refresh operation cycle and operating at a high speed and reduced power consumption in a normal operation cycleHITACHI LTD·Filed 1995·Granted Feb 17, 1998·22 cites·37 claims
- 3368US5546261ASuperconducting fault current limiterNGK INSULATORS LTD·Filed 1994·Granted Aug 13, 1996·27 cites·7 claims
- 3466US8415789B2Three-dimensionally integrated semicondutor device and method for manufacturing the sameISHIHARA MASAMICHI·Filed 2009·Granted Apr 9, 2013·3 cites·20 claims
- 3566US4912679AMemory including address registersHITACHI LTD·Filed 1988·Granted Mar 27, 1990·22 cites·16 claims
- 3665US5862095ASemiconductor memory having both a refresh operation cycle and a normal operation cycle and employing an address non-multiplex systemHITACHI LTD·Filed 1997·Granted Jan 19, 1999·18 cites·17 claims
- 3765US5534723ASemiconductor integrated circuit device having output and internal circuit MISFETSHITACHI LTD·Filed 1995·Granted Jul 9, 1996·18 cites·13 claims
- 3865US5289416ASemiconductor integrated device and wiring correction arrangement thereforHITACHI LTD·Filed 1992·Granted Feb 22, 1994·30 cites·51 claims
- 3964US10199310B2Semiconductor device and process for fabricating the sameLAPIS SEMICONDUCTOR CO LTD·Filed 2017·Granted Feb 5, 2019·0 cites·4 claims
- 4063US7825026B2Method for processing copper surface, method for forming copper pattern wiring and semiconductor device manufactured using such methodKYUSHU INST TECHNOLOGY·Filed 2005·Granted Nov 2, 2010·1 cites·10 claims
- 4163US5426613ASemiconductor memory device with improved substrate arrangement to permit forming a plurality of different types of random access memory, and a testing method thereforHITACHI LTD·Filed 1992·Granted Jun 20, 1995·18 cites·7 claims
- 4262US9887147B2Semiconductor device and process for fabricating the sameLAPIS SEMICONDUCTOR CO LTD·Filed 2016·Granted Feb 6, 2018·0 cites·5 claims
- 4362US7838983B2Packaged semiconductor device and method of manufacturing the packaged semiconductor deviceKYUSHU INST TECHNOLOGY·Filed 2006·Granted Nov 23, 2010·2 cites·4 claims
- 4462US5705775ACorona control ring having elongated water discharge holesNGK INSULATORS LTD·Filed 1995·Granted Jan 6, 1998·20 cites·9 claims
- 4562US5663863ALine arresterTOKYO ELECTRIC POWER CO·Filed 1995·Granted Sep 2, 1997·20 cites·21 claims
- 4662US4118794AMemory array with larger memory capacitors at row endsHITACHI LTD·Filed 1977·Granted Oct 3, 1978·9 cites·3 claims
- 4761US8952261B2Interconnect-use electronic component and method for producing sameISHIHARA MASAMICHI·Filed 2010·Granted Feb 10, 2015·1 cites·19 claims
- 4861US8399980B2Electronic component used for wiring and method for manufacturing the sameISHIHARA MASAMICHI·Filed 2009·Granted Mar 19, 2013·2 cites·18 claims
- 4960US9093431B2Semiconductor device and process for fabricating the sameLAPIS SEMICONDUCTOR CO LTD·Filed 2014·Granted Jul 28, 2015·0 cites·9 claims
- 5060US5359561ASemiconductor memory deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·22 cites·10 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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