Assignee
ISHIHARA MASAMICHI
JP·9 granted patents·30 citations·filing 2006–2012
Top patents by PatentIndex Score
9 records- 0188US8557700B2Method for manufacturing a chip-size double side connection packageISHIHARA MASAMICHI·Filed 2009·Granted Oct 15, 2013·12 cites·4 claims
- 0276US9812621B2Semiconductor device and fabrication method for sameISHIHARA MASAMICHI·Filed 2012·Granted Nov 7, 2017·5 cites·14 claims
- 0376US8110911B2Semiconductor chip package with post electrodesISHIHARA MASAMICHI·Filed 2009·Granted Feb 7, 2012·7 cites·13 claims
- 0466US8415789B2Three-dimensionally integrated semicondutor device and method for manufacturing the sameISHIHARA MASAMICHI·Filed 2009·Granted Apr 9, 2013·3 cites·20 claims
- 0561US8952261B2Interconnect-use electronic component and method for producing sameISHIHARA MASAMICHI·Filed 2010·Granted Feb 10, 2015·1 cites·19 claims
- 0661US8399980B2Electronic component used for wiring and method for manufacturing the sameISHIHARA MASAMICHI·Filed 2009·Granted Mar 19, 2013·2 cites·18 claims
- 0753US8664666B2Semiconductor device and process for fabricating the sameISHIHARA MASAMICHI·Filed 2011·Granted Mar 4, 2014·0 cites·21 claims
- 0849US8501542B2Double-faced electrode package, and its manufacturing methodISHIHARA MASAMICHI·Filed 2012·Granted Aug 6, 2013·0 cites·8 claims
- 0948US8154110B2Double-faced electrode package and its manufacturing methodISHIHARA MASAMICHI·Filed 2006·Granted Apr 10, 2012·0 cites·6 claims
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