Inventor · disambiguated record
Van Mieczkowski
Also filed as: MIECZKOWSKI VAN · MIECZKOWSKI VAN ALLEN
22 granted patents·2 pending applications·170 citations·filing 2002–2019
94Inventor score
Top patents by PatentIndex Score
24 records- 0192US9991399B2Passivation structure for semiconductor devicesCREE INC·Filed 2014·Granted Jun 5, 2018·11 cites·35 claims
- 0291US6825501B2Robust Group III light emitting diode for high reliability in standard packaging applicationsCREE INC·Filed 2002·Granted Nov 30, 2004·72 cites·21 claims
- 0389US9998109B1Power module with improved reliabilityCREE INC·Filed 2017·Granted Jun 12, 2018·7 cites·25 claims
- 0484US7125737B2Robust Group III light emitting diode for high reliability in standard packaging applicationsCREE INC·Filed 2004·Granted Oct 24, 2006·33 cites·24 claims
- 0582US8357996B2Devices with crack stopsCREE INC·Filed 2009·Granted Jan 22, 2013·6 cites·21 claims
- 0680US8907350B2Semiconductor devices having improved adhesion and methods of fabricating the sameMIECZKOWSKI VAN·Filed 2010·Granted Dec 9, 2014·5 cites·34 claims
- 0779US7473938B2Robust Group III light emitting diode for high reliability in standard packaging applicationsCREE INC·Filed 2006·Granted Jan 6, 2009·5 cites·20 claims
- 0875US8896122B2Semiconductor devices having gates including oxidized nickelMIECZKOWSKI VAN·Filed 2010·Granted Nov 25, 2014·4 cites·14 claims
- 0975US7557380B2Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond padsCREE INC·Filed 2004·Granted Jul 7, 2009·15 cites·11 claims
- 1074US9536783B2Wafer-level die attach metallizationCREE INC·Filed 2015·Granted Jan 3, 2017·2 cites·8 claims
- 1174US9142631B2Multilayer diffusion barriers for wide bandgap Schottky barrier devicesMIECZKOWSKI VAN·Filed 2010·Granted Sep 22, 2015·4 cites·8 claims
- 1269US10707858B2Power module with improved reliabilityCREE INC·Filed 2018·Granted Jul 7, 2020·1 cites·21 claims
- 1367US9343383B2High voltage semiconductor devices including electric arc suppression material and methods of forming the sameMIECZKOWSKI VAN·Filed 2012·Granted May 17, 2016·2 cites·36 claims
- 1467US7557379B2Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond padsCREE INC·Filed 2008·Granted Jul 7, 2009·2 cites·19 claims
- 1565US8877611B2Devices with crack stopsCREE INC·Filed 2012·Granted Nov 4, 2014·1 cites·25 claims
- 1661USRE49167EPassivation structure for semiconductor devicesWOLFSPEED INC·Filed 2019·Granted Aug 9, 2022·0 cites·51 claims
- 1752US8669563B2Light emitting devices having roughened/reflective contacts and methods of fabricating sameHABERERN KEVIN·Filed 2009·Granted Mar 11, 2014·0 cites·18 claims
- 1851US8810355B2Thin film resistorCREE INC·Filed 2013·Granted Aug 19, 2014·0 cites·16 claims
- 1950US2007145392A1Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structuresCREE INC·Filed 2007·Application pending·0 cites
- 2049US8471269B2Light emitting devices having roughened/reflective contacts and methods of fabricating sameHABERERN KEVIN·Filed 2011·Granted Jun 25, 2013·0 cites·9 claims
- 2147US8570140B2Thin film resistorMIECZKOWSKI VAN·Filed 2011·Granted Oct 29, 2013·0 cites·22 claims
- 2245US10020244B2Polymer via plugs with high thermal integrityMIECZKOWSKI VAN·Filed 2012·Granted Jul 10, 2018·0 cites·18 claims
- 2340US9607955B2Contact padMIECZKOWSKI VAN·Filed 2010·Granted Mar 28, 2017·0 cites·15 claims
- 2438US2006002442A1Light emitting devices having current blocking structures and methods of fabricating light emitting devices having current blocking structuresHABERERN KEVIN·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →