Inventor · disambiguated record
Stephen M. Sirard
Also filed as: SIRARD STEPHEN · SIRARD STEPHEN M
15 granted patents·11 pending applications·69 citations·filing 2007–2024
90Inventor score
Top patents by PatentIndex Score
26 records- 0192US8898928B2Delamination drying apparatus and methodLAM RES CORP·Filed 2012·Granted Dec 2, 2014·18 cites·19 claims
- 0291US7892445B1Wafer electrical discharge control using argon free dechucking gasLAM RES CORP·Filed 2007·Granted Feb 22, 2011·23 cites·20 claims
- 0390US11862473B2Controlled degradation of a stimuli-responsive polymer filmLAM RES CORP·Filed 2021·Granted Jan 2, 2024·2 cites·37 claims
- 0484US9673037B2Substrate freeze dry apparatus and methodSIRARD STEPHEN M·Filed 2011·Granted Jun 6, 2017·9 cites·11 claims
- 0580US12119218B2Sacrificial protection layer for environmentally sensitive surfaces of substratesLAM RES CORP·Filed 2020·Granted Oct 15, 2024·1 cites·20 claims
- 0675US7981699B2Method for tunably repairing low-k dielectric damageLAM RES CORP·Filed 2009·Granted Jul 19, 2011·6 cites·12 claims
- 0774US10068781B2Systems and methods for drying high aspect ratio structures without collapse using sacrificial bracing material that is removed using hydrogen-rich plasmaLAM RES CORP·Filed 2014·Granted Sep 4, 2018·4 cites·30 claims
- 0874US2024429040A1Sacrificial protection layer for environmentally sensitive surfaces of substratesLAM RES CORP·Filed 2024·Application pending·0 cites
- 0973US9466511B2Systems and methods for drying high aspect ratio structures without collapse using stimuli-responsive sacrificial bracing materialLAM RES CORP·Filed 2014·Granted Oct 11, 2016·3 cites·17 claims
- 1067US8236188B2Method for low-K dielectric etch with reduced damageJI BING·Filed 2010·Granted Aug 7, 2012·2 cites·18 claims
- 1157US8691701B2Strip with reduced low-K dielectric damageJI BING·Filed 2009·Granted Apr 8, 2014·1 cites·16 claims
- 1254US12322588B2Stimulus responsive polymer films and formulationsLAM RES CORP·Filed 2020·Granted Jun 3, 2025·0 cites·22 claims
- 1353US9773649B2Dry development and image transfer of si-containing self-assembled block copolymersLAM RES CORP·Filed 2014·Granted Sep 26, 2017·0 cites·24 claims
- 1452US2025132195A1Methods and formulations for sacrificial bracing, surface protection, and queue-time management using stimulus responsive polymersLAM RES CORP·Filed 2022·Application pending·0 cites
- 1548US9666427B2Method of collapse-free drying of high aspect ratio structuresLAM RES CORP·Filed 2013·Granted May 30, 2017·0 cites·19 claims
- 1648US2011097904A1Method for repairing low-k dielectric damageLAM RES CORP·Filed 2009·Application pending·0 cites
- 1747US2024312778A1Temporary capping material for oxide prevention in low temperature direct metal-metal bondingLAM RES CORP·Filed 2021·Application pending·0 cites
- 1847US2023178364A1Removable cvd polymer film for surface protection and queue period extensionLAM RES CORP·Filed 2021·Application pending·0 cites
- 1947US2023207305A1Residue-free removal of stimulus responsive polymers from substratesLAM RES CORP·Filed 2021·Application pending·0 cites
- 2047US2023295412A1Low ceiling temperature homopolymers as sacrificial protection layers for environmentally sensitive substratesLAM RES CORP·Filed 2021·Application pending·0 cites
- 2145US8114780B2Method for dielectric material removal between conductive linesBLOCK MAYUMI·Filed 2009·Granted Feb 14, 2012·0 cites·19 claims
- 2244US2009068767A1Tuning via facet with minimal rie lagLAM RES CORP·Filed 2007·Application pending·0 cites
- 2344US2022328338A1Small molecule films for sacrificial bracing, surface protection, and queue-time managementLAM RES CORP·Filed 2020·Application pending·0 cites
- 2444US2011244600A1Method for tunably repairing low-k dielectric damageLAM RES CORP·Filed 2011·Application pending·0 cites
- 2541US2014179097A1Deposition apparatus and methodLAM RES CORP·Filed 2012·Application pending·0 cites
- 2636US10008396B2Method for collapse-free drying of high aspect ratio structuresLAM RES CORP·Filed 2015·Granted Jun 26, 2018·0 cites·40 claims
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