Inventor · disambiguated record
Kenji Kanbara
Also filed as: KANBARA KENJI
6 granted patents·3 pending applications·8 citations·filing 2001–2019
72Inventor score
Top patents by PatentIndex Score
9 records- 0179US10396163B2Silicon carbide epitaxial substrate and method for manufacturing silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Aug 27, 2019·3 cites·22 claims
- 0275US9966249B2Silicon carbide semiconductor substrate and method for manufacturing sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Granted May 8, 2018·3 cites·18 claims
- 0369US12014924B2Silicon carbide epitaxial substrate and method for manufacturing silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Jun 18, 2024·1 cites·11 claims
- 0444US9559217B2Silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Granted Jan 31, 2017·0 cites·8 claims
- 0541US6810797B2Method of resin-sealing electronic parts, and stencil printing plate used thereforTORAY ENG CO LTD·Filed 2001·Granted Nov 2, 2004·1 cites·3 claims
- 0640US2013341648A1Method for manufacturing silicon carbide semiconductor device and silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Application pending·0 cites
- 0739US10526699B2Silicon carbide epitaxial substrate and method for manufacturing silicon carbide semiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Jan 7, 2020·0 cites·18 claims
- 0839US2014061670A1Wide gap semiconductor device and method for manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2013·Application pending·0 cites
- 0932US2018005816A1Semiconductor laminateSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →