Inventor · disambiguated record
Hidenori Egoshi
Also filed as: EGOSHI HIDENORI
6 granted patents·4 pending applications·39 citations·filing 2005–2016
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0192US8637892B2LED package and method for manufacturing sameEGOSHI HIDENORI·Filed 2010·Granted Jan 28, 2014·24 cites·8 claims
- 0278US8487418B2LED packageEGOSHI HIDENORI·Filed 2010·Granted Jul 16, 2013·6 cites·15 claims
- 0373US8525202B2LED package, method for manufacturing LED package, and packing member for LED packageWATARI GEN·Filed 2010·Granted Sep 3, 2013·4 cites·8 claims
- 0441USD515519SLight emitting semiconductor deviceTOSHIBA KK·Filed 2005·Granted Feb 21, 2006·5 cites·1 claims
- 0541US2015263065A1Light emitting device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 0638US10141482B2Semiconductor light emitting deviceALPAD CORP·Filed 2016·Granted Nov 27, 2018·0 cites·18 claims
- 0737US2013307014A1Semiconductor light emitting deviceYAMAMOTO MAMI·Filed 2012·Application pending·0 cites
- 0835US2012273826A1Led package and method for manufacturing sameYAMAMOTO MAMI·Filed 2011·Application pending·0 cites
- 0933US9853195B2Semiconductor light-emitting device and method for producing the sameTOSHIBA KK·Filed 2016·Granted Dec 26, 2017·0 cites·10 claims
- 1032US2016079217A1Semiconductor light emitting device and lead frameTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →