Inventor · disambiguated record
Jingli Yuan
Also filed as: YUAN JINGLI
11 granted patents·9 pending applications·105 citations·filing 1996–2021
90Inventor score
Files withSAMSUNG ELECTRO MECH9MATSUMOTO KAZUKO3SAMSUNG ELECTRONICS CO LTD3PARK SEUNG WOOK2JIAXING UPHOTON OPTOELECTRONICS TECH CO LTD1
Top patents by PatentIndex Score
20 records- 0191US7737687B2Fluxgate sensor having conbzr magnetic core and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 15, 2010·22 cites·8 claims
- 0289US7696004B2Wafer level package fabrication methodSAMSUNG ELECTRO MECH·Filed 2008·Granted Apr 13, 2010·23 cites·24 claims
- 0388US8093705B2Dual face package having resin insulating layerPARK SEUNG WOOK·Filed 2009·Granted Jan 10, 2012·14 cites·8 claims
- 0487US8273660B2Method of manufacturing a dual face packagePARK SEUNG WOOK·Filed 2011·Granted Sep 25, 2012·8 cites·13 claims
- 0583US7389576B2Method of manufacturing micro flux gate sensorSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 24, 2008·12 cites·9 claims
- 0677US7465747B2Fluorescent label compoundsMATSUMOTO KAZUKO·Filed 2003·Granted Dec 16, 2008·12 cites·29 claims
- 0767US8334602B2Die package including encapsulated die and method of manufacturing the sameKANG JOON SEOK·Filed 2009·Granted Dec 18, 2012·3 cites·3 claims
- 0852US2006029938A1Novel method of highly sensitive nucleic acid analysisMITSUBISHI RAYON CO·Filed 2003·Application pending·0 cites
- 0950US2008304821A1Camera module package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1049US11776152B2Mobile apparatus obstacle detection system, mobile apparatus, and ground-sweeping robotJIAXING UPHOTON OPTOELECTRONICS TECH CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 1148US2013056141A1Die package including encapsulated die and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1246US2009014827A1Image sensor module at wafer level, method of manufacturing the same, and camera moduleSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1346US2009253259A1Solder ball attachment jig and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1445US2009166859A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1545US2008296577A1Camera module packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1645US2008296714A1Wafer level package of image sensor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1745US2009166862A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1842US7571533B2Method of manufacturing a micro flux gate sensorSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 11, 2009·0 cites·7 claims
- 1939US6166251ALabeled reagents for use in immunoassays and fluorescent compounds and complexes used thereinMATSUMOTO KAZUKO·Filed 1998·Granted Dec 26, 2000·6 cites·9 claims
- 2037US5859297ALabeled reagents for use in immunoassays and fluorescent compounds and complexes used thereinMATSUMOTO KAZUKO·Filed 1996·Granted Jan 12, 1999·5 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →