Inventor · disambiguated record
Ikuo Ohnuma
Also filed as: OHNUMA IKUO
7 granted patents·3 pending applications·42 citations·filing 2002–2013
82Inventor score
Files withISHIDA KIYOHITO5JAPAN SCIENCE & TECH AGENCY2HORIO YUMA1TOYOTA MOTOR CO LTD1YAMADA YASUSHI1
Top patents by PatentIndex Score
10 records- 0193US8815027B2Fe-based shape memory alloy and its production methodISHIDA KIYOHITO·Filed 2010·Granted Aug 26, 2014·8 cites·20 claims
- 0285US7261760B2Member having separation structure and method for manufacture thereofISHIDA KIYOHITO·Filed 2002·Granted Aug 28, 2007·19 cites·2 claims
- 0382US8551265B2Cobalt-base alloy with high heat resistance and high strength and process for producing the sameISHIDA KIYOHITO·Filed 2008·Granted Oct 8, 2013·4 cites·8 claims
- 0482US7666352B2Iridium-based alloy with high heat resistance and high strength and process for producing the sameJAPAN SCIENCE & TECH AGENCY·Filed 2008·Granted Feb 23, 2010·4 cites·7 claims
- 0572US8283783B2Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the sameYAMADA YASUSHI·Filed 2008·Granted Oct 9, 2012·7 cites·27 claims
- 0660US9453274B2Cobalt-base alloy with high heat resistance and high strength and process for producing the sameJAPAN SCIENCE & TECH AGENCY·Filed 2013·Granted Sep 27, 2016·0 cites·18 claims
- 0751US9617622B2Hydrogen gas generating member and hydrogen gas producing method thereforISHIDA KIYOHITO·Filed 2008·Granted Apr 11, 2017·0 cites·6 claims
- 0846US2013333812A1Copper alloy and process for producing copper alloyISHIDA KIYOHITO·Filed 2011·Application pending·0 cites
- 0942US2010109016A1Power semiconductor moduleTOYOTA MOTOR CO LTD·Filed 2008·Application pending·0 cites
- 1035US2006210790A1Thermoelectric module and solder thereforHORIO YUMA·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →