Inventor · disambiguated record
Jeffrey L. Deeney
Also filed as: DEENEY JEFFREY L
13 granted patents·2 pending applications·373 citations·filing 1990–2015
92Inventor score
Top patents by PatentIndex Score
15 records- 0194US6477058B1Integrated circuit device package including multiple stacked componentsHEWLETT PACKARD CO·Filed 2001·Granted Nov 5, 2002·138 cites·20 claims
- 0288US6549418B1Land grid array integrated circuit device moduleHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Apr 15, 2003·46 cites·11 claims
- 0386US5783862AElectrically conductive thermal interfaceHEWLETT PACKARD CO·Filed 1997·Granted Jul 21, 1998·95 cites·22 claims
- 0481US6882536B2Wrap-around cooling arrangement for printed circuit boardHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Apr 19, 2005·34 cites·28 claims
- 0576US9623925B2Vehicle support standSTURDEVANT MICHAEL·Filed 2015·Granted Apr 18, 2017·4 cites·18 claims
- 0664US6600661B1Method and apparatus for supporting a circuit componentHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jul 29, 2003·12 cites·20 claims
- 0763US6791184B2Support assembly for an integrated circuit package having solder columnsHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 14, 2004·13 cites·40 claims
- 0858US6541710B1Method and apparatus of supporting circuit component having a solder column array using interspersed rigid columnsHEWLETT PACKARD CO·Filed 2001·Granted Apr 1, 2003·8 cites·12 claims
- 0948US6813162B2Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shimsHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Nov 2, 2004·2 cites·11 claims
- 1047US6710264B2Method and apparatus for supporting a circuit component having solder column interconnects using external supportHEWLETT PACKARD DEVELOPMENT CO·Filed 2001·Granted Mar 23, 2004·2 cites·18 claims
- 1145US7434309B2Method and apparatus for supporting a circuit component having solder column interconnects using an external supportHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Oct 14, 2008·1 cites·2 claims
- 1245US5521425ATape automated bonded (TAB) circuitHEWLETT PACKARD CO·Filed 1990·Granted May 28, 1996·16 cites·4 claims
- 1342US2005017349A1Method for supporting circuit component having solder column array interconnects using interposed support shimsFiled 2004·Application pending·0 cites
- 1438US7273386B2Pin shroudHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Sep 25, 2007·2 cites·29 claims
- 1534US2003020160A1Semiconductor device die and package having improved heat dissipation capabilityFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →