Inventor · disambiguated record
Mitsuo Ito
Also filed as: ITO MITSUO
13 granted patents·6 pending applications·316 citations·filing 1978–2024
92Inventor score
Top patents by PatentIndex Score
19 records- 0188US4746532AMethod for the production of endosseous implantsSUMITOMO CHEMICAL CO·Filed 1986·Granted May 24, 1988·99 cites·9 claims
- 0287US5078105AEngine for vehicleYAMAHA MOTOR CO LTD·Filed 1989·Granted Jan 7, 1992·42 cites·10 claims
- 0382US4492974ADMOS With gate protection diode formed over base regionHITACHI LTD·Filed 1982·Granted Jan 8, 1985·36 cites·15 claims
- 0480US4831424AInsulated gate semiconductor device with back-to-back diodesHITACHI LTD·Filed 1987·Granted May 16, 1989·36 cites·14 claims
- 0577US7295749B2Curable resin composition, optical component and optical waveguideOMRON TATEISI ELECTRONICS CO·Filed 2004·Granted Nov 13, 2007·15 cites·18 claims
- 0677US4806250ALiquid chromatography and apparatus using the sameHITACHI LTD·Filed 1988·Granted Feb 21, 1989·39 cites·6 claims
- 0771US10427394B2Method for curing resin compositionOMRON TATEISI ELECTRONICS CO·Filed 2014·Granted Oct 1, 2019·1 cites·7 claims
- 0861US5670379AChromatograph system and method of useHITACHI LTD·Filed 1995·Granted Sep 23, 1997·26 cites·29 claims
- 0951US10138348B2Resin composition and cured product thereofOMRON TATEISI ELECTRONICS CO·Filed 2014·Granted Nov 27, 2018·0 cites·4 claims
- 1050US2025184433A1Electronic apparatus, electronic system, noise determination method, and non-transitory recording mediumITO MITSUO·Filed 2024·Application pending·0 cites
- 1149US2010255313A1One-pack type epoxy resin composition and use thereofOMRON TATEISI ELECTRONICS CO·Filed 2009·Application pending·0 cites
- 1245US4688323AMethod for fabricating vertical MOSFETsHITACHI LTD·Filed 1985·Granted Aug 25, 1987·9 cites·5 claims
- 1343US2013160289A1One-pack type epoxy resin composition and use thereofITO MITSUO·Filed 2013·Application pending·0 cites
- 1439US2007041697A1Optical componentOMRON TATEISI ELECTRONICS CO·Filed 2004·Application pending·0 cites
- 1538US6429031B2Method for forming wiring pattern of a semiconductor integrated circuitFUJITSU LTD·Filed 2000·Granted Aug 6, 2002·0 cites·14 claims
- 1638US4170375APipe jointITO MITSUO·Filed 1978·Granted Oct 9, 1979·11 cites·2 claims
- 1737US2012105896A1Image forming apparatus and threshold setting methodITO MITSUO·Filed 2011·Application pending·0 cites
- 1835US2013022818A1One-pack epoxy resin composition, and use thereofOMRON TATEISI ELECTRONICS CO·Filed 2010·Application pending·0 cites
- 1931US5407568ASeparation column containing S-carboxyalkylcysteineHITACHI LTD·Filed 1993·Granted Apr 18, 1995·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →