Inventor · disambiguated record
Teik Tiong Toong
Also filed as: TOONG TEIK TIONG
8 granted patents·1 pending application·28 citations·filing 2008–2022
83Inventor score
Files withANALOG DEVICES INTERNATIONAL UNLIMITED CO3ALTERA CORP2TOONG TEIK TIONG2LIM CHOOI PEI1LIM KEN BENG1
Top patents by PatentIndex Score
9 records- 0186US11083089B1Integrated device packageANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2020·Granted Aug 3, 2021·5 cites·20 claims
- 0281US7989942B2IC package with capacitors disposed on an interposal layerALTERA CORP·Filed 2009·Granted Aug 2, 2011·10 cites·19 claims
- 0370US11189593B2Integrated device packageANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2019·Granted Nov 30, 2021·1 cites·20 claims
- 0470US8525326B2IC package with capacitors disposed on an interposal layerTOONG TEIK TIONG·Filed 2011·Granted Sep 3, 2013·3 cites·20 claims
- 0568US9601419B1Stacked leadframe packagesALTERA CORP·Filed 2014·Granted Mar 21, 2017·4 cites·13 claims
- 0661US9054077B2Package having spaced apart heat sinkLIM KEN BENG·Filed 2010·Granted Jun 9, 2015·2 cites·19 claims
- 0760US8786080B2Systems including an I/O stack and methods for fabricating such systemsLIM CHOOI PEI·Filed 2011·Granted Jul 22, 2014·2 cites·14 claims
- 0852US8541263B1Thermoset molding for on-package decoupling in flip chipsTOONG TEIK TIONG·Filed 2008·Granted Sep 24, 2013·1 cites·21 claims
- 0950US2022359353A1Package with laser lapped surface and method of manufacturing sameANALOG DEVICES INTERNATIONAL UNLIMITED CO·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →