Inventor · disambiguated record
Han-Wen Lin
Also filed as: LIN HAN-WEN
6 granted patents·6 pending applications·16 citations·filing 2013–2024
77Inventor score
Top patents by PatentIndex Score
12 records- 0189US10079218B1Test method for a redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Sep 18, 2018·7 cites·20 claims
- 0283US10796931B2Manufacturing method of package structurePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Oct 6, 2020·3 cites·15 claims
- 0372US11532575B2Integrated antenna package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Granted Dec 20, 2022·1 cites·19 claims
- 0470US10002848B1Test method for a redistribution layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 19, 2018·1 cites·22 claims
- 0570US8952267B2Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the sameUNIV NAT CHIAO TUNG·Filed 2013·Granted Feb 10, 2015·3 cites·24 claims
- 0666US10438931B2Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2018·Granted Oct 8, 2019·1 cites·13 claims
- 0755US2024332126A1Thermal grounding in backside power schemes using carrier wafersINTEL CORP·Filed 2023·Application pending·0 cites
- 0851US2023387073A1Integrated circuit assemblies having interconnection bridges spanning integrated circuit devices thereinINTEL CORP·Filed 2022·Application pending·0 cites
- 0951US2025030202A1Electronic system assembly for electromagnetic interference reduction and electrical arcing protectionEPIRUS INC·Filed 2024·Application pending·0 cites
- 1050US2023420413A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 1148US2024258714A1Multiport antenna, multiport antenna system, and methods of operationEPIRUS INC·Filed 2024·Application pending·0 cites
- 1248US2019013214A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →