Inventor · disambiguated record
Chien-Hsin Huang
Also filed as: HUANG CHIEN-HSIN
42 granted patents·4 pending applications·589 citations·filing 2004–2020
98Inventor score
Top patents by PatentIndex Score
46 records- 0199USD732498SPortable electronic deviceHTC CORP·Filed 2013·Granted Jun 23, 2015·222 cites·1 claims
- 0296US8587078B2Integrated circuit and fabricating method thereofHUANG CHIEN-HSIN·Filed 2010·Granted Nov 19, 2013·37 cites·20 claims
- 0396US8368153B2Wafer level package of MEMS microphone and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2010·Granted Feb 5, 2013·29 cites·18 claims
- 0492US8525389B2MEMS device with protection ringsTAN TZUNG-HAN·Filed 2010·Granted Sep 3, 2013·12 cites·8 claims
- 0591USD926160SEarphones charging caseHMD GLOBAL OY·Filed 2020·Granted Jul 27, 2021·15 cites·1 claims
- 0690USD810726SPortable electronic deviceHTC CORP·Filed 2016·Granted Feb 20, 2018·36 cites·1 claims
- 0788US8558336B2Semiconductor photodetector structure and the fabrication method thereofSU TZUNG-I·Filed 2009·Granted Oct 15, 2013·13 cites·14 claims
- 0888US8525354B2Bond pad structure and fabricating method thereofWU HUI-MIN·Filed 2011·Granted Sep 3, 2013·14 cites·16 claims
- 0987USD789316SPortable electronic deviceHTC CORP·Filed 2015·Granted Jun 13, 2017·28 cites·1 claims
- 1087US8531827B2Electronic device and keyboard module thereofHUANG CHIEN-HSIN·Filed 2009·Granted Sep 10, 2013·25 cites·16 claims
- 1186USD760681SPortable electronic deviceHTC CORP·Filed 2014·Granted Jul 5, 2016·32 cites·1 claims
- 1285US8310065B2Semiconductor device and wafer structureWU HUI-MIN·Filed 2011·Granted Nov 13, 2012·9 cites·13 claims
- 1383US8867770B2Speaker-connector module and handheld electronic deviceCHIEN CHIH-LING·Filed 2011·Granted Oct 21, 2014·9 cites·22 claims
- 1483US8299555B2Semiconductor optoelectronic structureSU TZUNG-I·Filed 2009·Granted Oct 30, 2012·13 cites·9 claims
- 1582US8865500B2Method of fabricating a MEMS microphone with trenches serving as vent patternHUANG CHIEN-HSIN·Filed 2010·Granted Oct 21, 2014·6 cites·10 claims
- 1678USD754090SPortable electronic deviceHTC CORP·Filed 2014·Granted Apr 19, 2016·21 cites·1 claims
- 1778US8096048B2Method for fabricating MEMS structureLAN BANG-CHIANG·Filed 2010·Granted Jan 17, 2012·3 cites·8 claims
- 1877US9150407B2Method for fabricating MEMS device with protection ringsUNITED MICROELECTRONICS CORP·Filed 2013·Granted Oct 6, 2015·2 cites·11 claims
- 1977US7898081B2MEMS device and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2008·Granted Mar 1, 2011·8 cites·24 claims
- 2072US8208768B2Focusing member and optoelectronic deviceSU TZUNG-I·Filed 2009·Granted Jun 26, 2012·6 cites·10 claims
- 2171US7851975B2MEMS structure with metal protection ringsUNITED MICROELECTRONICS CORP·Filed 2008·Granted Dec 14, 2010·3 cites·15 claims
- 2269US8872287B2Integrated structure for MEMS device and semiconductor device and method of fabricating the sameLAN BANG-CHIANG·Filed 2008·Granted Oct 28, 2014·3 cites·19 claims
- 2368US9783408B2Structure of MEMS electroacoustic transducerUNITED MICROELECTRONICS CORP·Filed 2014·Granted Oct 10, 2017·2 cites·8 claims
- 2467US9331391B2Mobile deviceCHIEN CHIH-LING·Filed 2012·Granted May 3, 2016·3 cites·17 claims
- 2567US8642986B2Integrated circuit having microelectromechanical system device and method of fabricating the sameTAN TZUNG-HAN·Filed 2009·Granted Feb 4, 2014·3 cites·8 claims
- 2664USD885362SEarphones and caseHMD GLOBAL OY·Filed 2018·Granted May 26, 2020·7 cites·1 claims
- 2762US8710601B2MEMS structure and method for making the sameHUANG CHIEN-HSIN·Filed 2009·Granted Apr 29, 2014·2 cites·17 claims
- 2861US7190654B2Disc burner and its control methodIND TECH RES INST·Filed 2004·Granted Mar 13, 2007·5 cites·10 claims
- 2960US8193640B2MEMS and a protection structure thereofLAN BANG-CHIANG·Filed 2009·Granted Jun 5, 2012·2 cites·20 claims
- 3059US8139907B2Optoelectronic device and method of forming the sameSU TZUNG-I·Filed 2009·Granted Mar 20, 2012·2 cites·22 claims
- 3158US8384214B2Semiconductor structure, pad structure and protection structureUNITED MICROELECTRONICS CORP·Filed 2009·Granted Feb 26, 2013·1 cites·16 claims
- 3256US9988264B2Method of fabricating integrated structure for MEMS device and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jun 5, 2018·0 cites·10 claims
- 3355US8049125B2Key structureHTC CORP·Filed 2008·Granted Nov 1, 2011·1 cites·15 claims
- 3453US8798291B2Structure of MEMS electroacoustic transducer and fabricating method thereofLAN BANG-CHIANG·Filed 2008·Granted Aug 5, 2014·0 cites·12 claims
- 3552US8502382B2MEMS and protection structure thereofLAN BANG-CHIANG·Filed 2012·Granted Aug 6, 2013·0 cites·19 claims
- 3651US7376342B2Method of determining disc type for disc burnersIND TECH RES INST·Filed 2004·Granted May 20, 2008·1 cites·14 claims
- 3750USD579932SPortable electronic deviceHTC CORP·Filed 2006·Granted Nov 4, 2008·7 cites·1 claims
- 3848US7973763B2Electronic devices with sensible orientation structures, and associated methodsHTC CORP·Filed 2007·Granted Jul 5, 2011·0 cites·37 claims
- 3947US10825588B2Voltage dividing resistorLIU CHUNG LIN·Filed 2019·Granted Nov 3, 2020·0 cites·11 claims
- 4047US2011084344A1Mems device with a composite back plate electrode and method of making the sameHUANG CHIEN-HSIN·Filed 2009·Application pending·0 cites
- 4143USD879754SPortable electronic deviceHTC CORP·Filed 2017·Granted Mar 31, 2020·3 cites·1 claims
- 4243US2011158582A1Structure of a semiconductor device having a waveguide and method of forming the sameSU TZUNG-I·Filed 2009·Application pending·0 cites
- 4342USD679264SPortable electronic deviceHUANG CHIEN-HSIN·Filed 2011·Granted Apr 2, 2013·4 cites·1 claims
- 4442US2007236479A1Intuitive image navigatorHIGH TECH COMP CORP·Filed 2007·Application pending·0 cites
- 4539US2007066055A1Method of fabricating conductive layerHUANG CHIEN-HSIN·Filed 2005·Application pending·0 cites
- 4633US8460960B2Method for fabricating integrated circuitLIN MENG-JIA·Filed 2011·Granted Jun 11, 2013·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →