Inventor · disambiguated record
Xiang Yin Zeng
Also filed as: ZENG XIANG Y · ZENG XIANG YIN
20 granted patents·9 pending applications·304 citations·filing 2004–2010
95Inventor score
Top patents by PatentIndex Score
29 records- 0197US7659143B2Dual-chip integrated heat spreader assembly, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted Feb 9, 2010·71 cites·18 claims
- 0296US7535080B2Reducing parasitic mutual capacitancesINTEL CORP·Filed 2005·Granted May 19, 2009·87 cites·14 claims
- 0394US7723164B2Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 25, 2010·32 cites·23 claims
- 0491US7477197B2Package level integration of antenna and RF front-end moduleINTEL CORP·Filed 2006·Granted Jan 13, 2009·32 cites·20 claims
- 0581US7511359B2Dual die package with high-speed interconnectINTEL CORP·Filed 2005·Granted Mar 31, 2009·11 cites·10 claims
- 0681US7123466B2Extended thin film capacitor (TFC)INTEL CORP·Filed 2005·Granted Oct 17, 2006·8 cites·18 claims
- 0779US7227247B2IC package with signal land padsINTEL CORP·Filed 2005·Granted Jun 5, 2007·10 cites·23 claims
- 0876US7255573B2Data signal interconnection with reduced crosstalkINTEL CORP·Filed 2005·Granted Aug 14, 2007·16 cites·11 claims
- 0976US7027289B2Extended thin film capacitor (TFC)INTEL CORP·Filed 2004·Granted Apr 11, 2006·17 cites·30 claims
- 1075US7564066B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2005·Granted Jul 21, 2009·5 cites·11 claims
- 1170US8189361B2Multi-chip assembly with optically coupled dieZHOU QING A·Filed 2010·Granted May 29, 2012·3 cites·4 claims
- 1268US7709934B2Package level noise isolationINTEL CORP·Filed 2006·Granted May 4, 2010·4 cites·14 claims
- 1365US7535689B2Reducing input capacitance of high speed integrated circuitsINTEL CORP·Filed 2007·Granted May 19, 2009·4 cites·8 claims
- 1460US7851809B2Multi-chip assembly with optically coupled dieINTEL CORP·Filed 2009·Granted Dec 14, 2010·1 cites·5 claims
- 1557US7852189B2Packaged spiral inductor structures, processes of making same, and systems containing sameINTEL CORP·Filed 2005·Granted Dec 14, 2010·1 cites·22 claims
- 1651US7989916B2Integrated capacitors in package-level structures, processes of making same, and systems containing sameINTEL CORP·Filed 2009·Granted Aug 2, 2011·0 cites·22 claims
- 1747US7714430B2Substrate with lossy material insertINTEL CORP·Filed 2006·Granted May 11, 2010·0 cites·18 claims
- 1847US2006124985A1Methods of forming in package integrated capacitors and structures formed therebyZENG XIANG Y·Filed 2006·Application pending·0 cites
- 1946US2008157335A1Strip patterned transmission lineTANG JIA MIAO·Filed 2006·Application pending·0 cites
- 2044US7670919B2Integrated capacitors in package-level structures, processes of making same, and systems containing sameINTEL CORP·Filed 2005·Granted Mar 2, 2010·0 cites·19 claims
- 2144US2008145977A1Increasing the resistance of a high frequency input/output power delivery decoupling pathZENG XIANG YIN·Filed 2006·Application pending·0 cites
- 2243US2008157322A1Double side stacked die packageTANG JIA MIAO·Filed 2006·Application pending·0 cites
- 2342US2008157324A1Stacked die package with die interconnectsTANG JIA MIAO·Filed 2006·Application pending·0 cites
- 2441US7981726B2Copper plating connection for multi-die stack in substrate packageINTEL CORP·Filed 2005·Granted Jul 19, 2011·0 cites·5 claims
- 2541US2006081998A1Methods of forming in package integrated capacitors and structures formed therebyZENG XIANG Y·Filed 2004·Application pending·0 cites
- 2641US2007145543A1Plating bar design for high speed package designZENG XIANG Y·Filed 2005·Application pending·0 cites
- 2741US2009039482A1Package Including a Microprocessor & Fourth Level CacheHE JIANGQI·Filed 2005·Application pending·0 cites
- 2840US2007146105A1Complementary inductor structuresZENG XIANG Y·Filed 2005·Application pending·0 cites
- 2937US7348661B2Array capacitor apparatuses to filter input/output signalINTEL CORP·Filed 2004·Granted Mar 25, 2008·2 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →