Inventor · disambiguated record
Martin Franosch
Also filed as: FRANOSCH MARTIN
48 granted patents·7 pending applications·724 citations·filing 1996–2017
98Inventor score
Files withINFINEON TECHNOLOGIES AG27SIEMENS AG14OPPERMANN KLAUS-GUENTER4AVAGO TECHNOLOGIES WIRELESS IP2SCHAEFER HERBERT2
Top patents by PatentIndex Score
55 records- 0196US5998807AIntegrated CMOS circuit arrangement and method for the manufacture thereofSIEMENS AG·Filed 1997·Granted Dec 7, 1999·179 cites·6 claims
- 0294US7288435B2Method for producing a cover, method for producing a packaged deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 30, 2007·89 cites·13 claims
- 0392US7728485B2Bulk acoustic wave device and a method of its manufacturingAVAGO TECHNOLOGIES WIRELESS IP·Filed 2008·Granted Jun 1, 2010·24 cites·26 claims
- 0489US6215140B1Electrically programmable non-volatile memory cell configurationSIEMENS AG·Filed 1999·Granted Apr 10, 2001·64 cites·29 claims
- 0582US7692317B2Apparatus for housing a micromechanical structureINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 6, 2010·8 cites·2 claims
- 0675US6159815AMethod of producing a MOS transistorSIEMENS AG·Filed 1996·Granted Dec 12, 2000·39 cites·3 claims
- 0774US6040995AMethod of operating a storage cell arrangementSIEMENS AG·Filed 1997·Granted Mar 21, 2000·35 cites·4 claims
- 0872US8102052B2Process for the simultaneous deposition of crystalline and amorphous layers with dopingSCHAEFER HERBERT·Filed 2011·Granted Jan 24, 2012·2 cites·1 claims
- 0972US6127220AManufacturing method for a capacitor in an integrated storage circuitSIEMENS AG·Filed 1999·Granted Oct 3, 2000·29 cites·10 claims
- 1071US7745321B2Solder contacts and methods of forming sameQIMONDA AG·Filed 2008·Granted Jun 29, 2010·5 cites·11 claims
- 1170US7947552B2Process for the simultaneous deposition of crystalline and amorphous layers with dopingINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 24, 2011·2 cites·19 claims
- 1270US7300823B2Apparatus for housing a micromechanical structure and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Nov 27, 2007·14 cites·3 claims
- 1369US6878600B2Method for fabricating trench capacitors and semiconductor device with trench capacitorsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 12, 2005·11 cites·33 claims
- 1467US7682777B2Method for producing a polymer structure on a substrate surfaceINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 23, 2010·2 cites·15 claims
- 1566US6909141B2Method for producing a vertical semiconductor transistor component and vertical semiconductor transistor componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 21, 2005·13 cites·16 claims
- 1666US6635545B2Method for fabricating a bipolar transistor and method for fabricating an integrated circuit configuration having such a bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 21, 2003·13 cites·10 claims
- 1763US6955950B2Method for generating a protective cover for a deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 18, 2005·9 cites·20 claims
- 1862US8872335B2Electronic device and method of manufacturing sameHUEBNER HOLGER·Filed 2007·Granted Oct 28, 2014·3 cites·21 claims
- 1961US5943571AMethod for manufacturing fine structuresSIEMENS AG·Filed 1997·Granted Aug 24, 1999·25 cites·5 claims
- 2060US6863769B2Configuration and method for making contact with the back surface of a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 8, 2005·7 cites·9 claims
- 2160US6204119B1Manufacturing method for a capacitor in an integrated memory circuitSIEMENS AG·Filed 1999·Granted Mar 20, 2001·19 cites·10 claims
- 2259US7234237B2Method for producing a protective cover for a deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 26, 2007·8 cites·15 claims
- 2359US6197666B1Method for the fabrication of a doped silicon layerSIEMENS AG·Filed 1999·Granted Mar 6, 2001·21 cites·12 claims
- 2458US6939734B2Method for producing a protective cover for a deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 6, 2005·7 cites·20 claims
- 2556US7612430B2Silicon bipolar transistor, circuit arrangement and method for producing a silicon bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 3, 2009·7 cites·14 claims
- 2656US6117790AMethod for fabricating a capacitor for a semiconductor memory configurationSIEMENS AG·Filed 1999·Granted Sep 12, 2000·16 cites·13 claims
- 2755US6605487B2Method for the manufacture of micro-mechanical componentsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 12, 2003·10 cites·21 claims
- 2854US8501534B2Method for housing an electronic component in a device package and an electronic component housed in the device packageOPPERMANN KLAUS-GUENTER·Filed 2008·Granted Aug 6, 2013·2 cites·17 claims
- 2954US6022786AMethod for manufacturing a capacitor for a semiconductor arrangementSIEMENS AG·Filed 1998·Granted Feb 8, 2000·15 cites·13 claims
- 3052US8884437B2Electrical device with protruding contact elements and overhang regions over a cavityINFINEON TECHNOLOGIES AG·Filed 2012·Granted Nov 11, 2014·0 cites·20 claims
- 3152US8329532B2Process for the simultaneous deposition of crystalline and amorphous layers with dopingSCHAEFER HERBERT·Filed 2011·Granted Dec 11, 2012·0 cites·20 claims
- 3252US8319344B2Electrical device with protruding contact elements and overhang regions over a cavityOPPERMANN KLAUS-GUENTER·Filed 2008·Granted Nov 27, 2012·0 cites·12 claims
- 3352US6140177AProcess of forming a semiconductor capacitor including forming a hemispherical grain statistical mask with silicon and germaniumSIEMENS AG·Filed 1997·Granted Oct 31, 2000·13 cites·5 claims
- 3452US5817553AProcess for manufacturing capacitors in a solid state configurationSIEMENS AG·Filed 1996·Granted Oct 6, 1998·12 cites·6 claims
- 3551US6867105B2Bipolar transistor and method of fabricating a bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 15, 2005·4 cites·10 claims
- 3650US7851333B2Apparatus comprising a device and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 14, 2010·0 cites·8 claims
- 3749US9312212B2Method for housing an electronic component in a device package and an electronic component housed in the device packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 12, 2016·0 cites·24 claims
- 3848US6746880B2Method for making electrical contact with a rear side of a semiconductor substrate during its processingINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 8, 2004·2 cites·18 claims
- 3946US2011133297A1Semiconductor component and method for producing semiconductor componentsAVAGO TECHNOLOGIES WIRELESS IP·Filed 2011·Application pending·0 cites
- 4045US8618621B2Semiconductor device layer structure and method of fabricationOPPERMANN KLAUS-GUENTER·Filed 2010·Granted Dec 31, 2013·0 cites·10 claims
- 4145US8148055B2Method for developing a photoresistOPPERMANN KLAUS-GUENTER·Filed 2007·Granted Apr 3, 2012·0 cites·37 claims
- 4245US7064360B2Bipolar transistor and method for fabricating itINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 20, 2006·2 cites·21 claims
- 4343US10804875B2Polymer lid wafer-level package with an electrically and thermally conductive pillarAVAGO TECH INT SALES PTE LID·Filed 2017·Granted Oct 13, 2020·0 cites·24 claims
- 4443US7135757B2Bipolar transistorINFINEON TECHNOLOGIES AG·Filed 2004·Granted Nov 14, 2006·1 cites·12 claims
- 4543US2007182029A1Semiconductor component and method for producing semiconductor componentsINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 4642US6903454B2Contact spring configuration for contacting a semiconductor wafer and method for producing a contact spring configurationINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 7, 2005·1 cites·46 claims
- 4742US6133126AMethod for fabricating a dopant regionSIEMENS AG·Filed 1999·Granted Oct 17, 2000·9 cites·8 claims
- 4842US2006191868A1Concept for the wet-chemical removal of a sacrificial material in a material structureINFINEON TECHNOLOGIES AG·Filed 2006·Application pending·0 cites
- 4942US2006183325A1Lift-off methodINFINEON TECHNOLOGIES AG·Filed 2006·Application pending·0 cites
- 5042US2015014795A1Surface passivation of substrate by mechanically damaging surface layerAVAGO TECHNOLOGIES GENERAL IP·Filed 2013·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →