Inventor · disambiguated record
Daisuke Mizutani
Also filed as: MIZUTANI DAISUKE
36 granted patents·14 pending applications·486 citations·filing 1993–2022
97Inventor score
Top patents by PatentIndex Score
50 records- 0195US5478972AMultilayer circuit board and a method for fabricating the sameFUJITSU LTD·Filed 1994·Granted Dec 26, 1995·111 cites·11 claims
- 0293USD884725SDisplay screen with graphical user interfaceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 19, 2020·65 cites·1 claims
- 0392USD881918SDisplay screen with graphical user interfaceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 21, 2020·57 cites·1 claims
- 0491US6001488AComposition of epoxy group-containing cycloolefin resinNIPPON ZEON CO·Filed 1998·Granted Dec 14, 1999·58 cites·4 claims
- 0586US9326372B2Semiconductor device manufacturing method and semiconductor mounting substrateFUJITSU LTD·Filed 2015·Granted Apr 26, 2016·5 cites·4 claims
- 0680US11057996B2Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2019·Granted Jul 6, 2021·3 cites·11 claims
- 0780US9699887B2Circuit board and electronic deviceFUJITSU LTD·Filed 2014·Granted Jul 4, 2017·6 cites·16 claims
- 0878US8446020B2Multi-chip moduleKOIDE MASATERU·Filed 2010·Granted May 21, 2013·5 cites·8 claims
- 0978US5386430AExcimer laser processing method and apparatusFUJITSU LTD·Filed 1993·Granted Jan 31, 1995·46 cites·24 claims
- 1075US8546187B2Electronic part and method of manufacturing the sameKOIDE MASATERU·Filed 2010·Granted Oct 1, 2013·4 cites·6 claims
- 1173USD894923SDisplay screen with animated graphical user interfaceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Sep 1, 2020·15 cites·1 claims
- 1271US5783639AComposition of epoxy group-containing cycloolefin resinNIPON ZEON CO LTD·Filed 1997·Granted Jul 21, 1998·27 cites·7 claims
- 1369US9048332B2Semiconductor device manufacturing method and semiconductor mounting substrateFUJITSU LTD·Filed 2013·Granted Jun 2, 2015·2 cites·6 claims
- 1465US8811031B2Multichip module and method for manufacturing the sameKOIDE MASATERU·Filed 2010·Granted Aug 19, 2014·2 cites·10 claims
- 1564US10896871B2Circuit board, method for manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2018·Granted Jan 19, 2021·1 cites·10 claims
- 1664US7996196B2Structural analysis of a printed wiring substrateFUJITSU LTD·Filed 2009·Granted Aug 9, 2011·2 cites·12 claims
- 1763US10311189B2Simulation method and simulation apparatusFUJITSU LTD·Filed 2014·Granted Jun 4, 2019·1 cites·16 claims
- 1861USD873295SDisplay screen with animated graphical user interfaceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 21, 2020·9 cites·1 claims
- 1961US7791197B2Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting memberFUJITSU LTD·Filed 2008·Granted Sep 7, 2010·1 cites·14 claims
- 2061US6992861B2Head suspension for swing arm actuatorFUJITSU LTD·Filed 2002·Granted Jan 31, 2006·4 cites·14 claims
- 2161US5895800AComposition of epoxy group-containing cycloolefin resinNIPPON ZEON CO·Filed 1998·Granted Apr 20, 1999·21 cites·8 claims
- 2259US7851707B2Circuit board and method for manufacturing the sameFUJITSU LTD·Filed 2006·Granted Dec 14, 2010·2 cites·10 claims
- 2358US9055685B2Electric circuit apparatus and manufacturing method thereforFUJITSU LTD·Filed 2013·Granted Jun 9, 2015·1 cites·10 claims
- 2457US2024313235A1Polymer electrolyte fuel cell sealing materialTOMOEGAWA CO LTD·Filed 2022·Application pending·0 cites
- 2556US8952271B2Circuit board, semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2013·Granted Feb 10, 2015·0 cites·6 claims
- 2656US7671281B2Multilayer wiring circuit boardFUJITSU LTD·Filed 2002·Granted Mar 2, 2010·5 cites·9 claims
- 2755US10701808B2Capacitor built-in multilayer wiring substrate and manufacturing method thereofFUJITSU LTD·Filed 2019·Granted Jun 30, 2020·0 cites·4 claims
- 2853US10362677B2Capacitor built-in multilayer wiring substrate and manufacturing method thereofFUJITSU LTD·Filed 2018·Granted Jul 23, 2019·0 cites·10 claims
- 2953US2009090543A1Circuit board, semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Application pending·0 cites
- 3052US5886136APattern forming processNIPPON ZEON CO·Filed 1997·Granted Mar 23, 1999·12 cites·28 claims
- 3151US7253023B2Multilayer wiring circuit boardFUJITSU LTD·Filed 2004·Granted Aug 7, 2007·3 cites·2 claims
- 3251US2015189751A1Wiring board, method for fabricating the same, and electronic apparatusFUJITSU LTD·Filed 2014·Application pending·0 cites
- 3348US10770386B2Wiring board, electronic device, and wiring board manufacturing methodFUJITSU LTD·Filed 2018·Granted Sep 8, 2020·0 cites·7 claims
- 3448US9754830B2Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic deviceFUJITSU LTD·Filed 2016·Granted Sep 5, 2017·0 cites·8 claims
- 3548US5777068APhotosensitive polyimide resin compositionNIPPON ZEON CO·Filed 1995·Granted Jul 7, 1998·11 cites·25 claims
- 3647US2014021609A1Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3744US11317520B2Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2018·Granted Apr 26, 2022·0 cites·8 claims
- 3844US2019306982A1Circuit board and method of manufacturing circuit boardFUJITSU LTD·Filed 2019·Application pending·0 cites
- 3943US2011080717A1Interconnect board, printed circuit board unit, and methodFUJITSU LTD·Filed 2010·Application pending·0 cites
- 4043US2011235673A1Analysis apparatus, analysis method and analysis programFUJITSU LTD·Filed 2011·Application pending·0 cites
- 4143US2019287893A1Wiring substrate, semiconductor module, and manufacturing method for wiring substrateFUJITSU LTD·Filed 2019·Application pending·0 cites
- 4242US2007221400A1Multilayer interconnection substrate, semiconductor device, and solder resistFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4342US2020245463A1Capacitor-embedded substrate and electronic apparatusFUJITSU LTD·Filed 2020·Application pending·0 cites
- 4441US2019215963A1Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 4540US2019306981A1Circuit substrate and method for fabricating circuit substrateFUJITSU LTD·Filed 2019·Application pending·0 cites
- 4639US2007217173A1Circuit boardFUJITSU LTD·Filed 2006·Application pending·0 cites
- 4737US10396020B2Method of manufacturing boardFUJITSU LTD·Filed 2018·Granted Aug 27, 2019·0 cites·6 claims
- 4836US5429709AMethod of manufacturing polyimide multilayer printed wiring boardsFUJITSU LTD·Filed 1994·Granted Jul 4, 1995·7 cites·9 claims
- 4935US2017006699A1Multilayer circuit board, semiconductor apparatus, and method of manufacturing multilayer circuit boardFUJITSU LTD·Filed 2016·Application pending·0 cites
- 5033US9030007B2Semiconductor device and manufacturing method thereofMIZUTANI DAISUKE·Filed 2010·Granted May 12, 2015·0 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →