Inventor · disambiguated record
Sankar Paul
Also filed as: PAUL SANKAR · PAUL SANKAR J · PAUL SANKAR K
4 granted patents·1 pending application·16 citations·filing 2006–2014
70Inventor score
Top patents by PatentIndex Score
5 records- 0188US8632874B2Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewithPAUL SANKAR·Filed 2010·Granted Jan 21, 2014·10 cites·21 claims
- 0282US8519273B2Circuit materials with improved bond, method of manufacture thereof, and articles formed therefromPAUL SANKAR·Filed 2009·Granted Aug 27, 2013·3 cites·22 claims
- 0376US8809690B2Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereofBAARS DIRK M·Filed 2011·Granted Aug 19, 2014·3 cites·22 claims
- 0457US9918384B2Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereofROGERS CORP·Filed 2014·Granted Mar 13, 2018·0 cites·20 claims
- 0545US2007093035A1Circuit board materials with improved bond to conductive metals and methods of the manufacture thereofDAIGLE ROBERT C·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →