Inventor · disambiguated record
Sensho Usami
Also filed as: USAMI SENSHO
10 granted patents·4 pending applications·13 citations·filing 2012–2019
83Inventor score
Files withMICRON TECHNOLOGY INC7ELPIDA MEMORY INC2PS5 LUXCO S A R L2LONGITUDE LICENSING LTD1PS4 LUXCO SARL1
Top patents by PatentIndex Score
14 records- 0182US10431556B2Semiconductor device including semiconductor chips mounted over both surfaces of substrateMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 1, 2019·3 cites·23 claims
- 0279US9418968B2Semiconductor device including semiconductor chips mounted over both surfaces of substrateMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 16, 2016·3 cites·20 claims
- 0376US10537018B2Semiconductor deviceLONGITUDE LICENSING LTD·Filed 2019·Granted Jan 14, 2020·2 cites·10 claims
- 0471US9418907B2Method for manufacturing semiconductor devicePS5 LUXCO S A R L·Filed 2014·Granted Aug 16, 2016·3 cites·6 claims
- 0566US9799611B2Semiconductor device including semiconductor chips mounted over both surfaces of substrateMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 24, 2017·1 cites·20 claims
- 0661US9748204B2Semiconductor device including semiconductor chips stacked over substrateMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 29, 2017·1 cites·18 claims
- 0750US11069655B2Semiconductor device including two or more chips mounted over wiring substrateMICRON TECHNOLOGY INC·Filed 2017·Granted Jul 20, 2021·0 cites·13 claims
- 0850US10342118B2Semiconductor devicePS4 LUXCO SARL·Filed 2014·Granted Jul 2, 2019·0 cites·10 claims
- 0945US9837377B2Semiconductor device including two or more chips mounted over wiring substrateMICRON TECHNOLOGY INC·Filed 2014·Granted Dec 5, 2017·0 cites·20 claims
- 1043US2017005020A1Method for manufacturing semiconductor devicePS5 LUXCO S A R L·Filed 2016·Application pending·0 cites
- 1141US2014008775A1Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Application pending·0 cites
- 1237US2013137217A1Method of manufacturing semiconductor deviceELPIDA MEMORY INC·Filed 2012·Application pending·0 cites
- 1337US2012273971A1Semiconductor device and method of manufacturing the sameUSAMI SENSHO·Filed 2012·Application pending·0 cites
- 1432US9601447B2Semiconductor device including plural semiconductor chips stacked on substrateMICRON TECHNOLOGY INC·Filed 2015·Granted Mar 21, 2017·0 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →