Inventor · disambiguated record
Yuping Gong
Also filed as: GONG YUPING
21 granted patents·3 pending applications·123 citations·filing 2010–2024
94Inventor score
Files withGONG YUPING8ALPHA & OMEGA SEMICONDUCTOR4ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD2SHI LEI2XUE YAN XUN2
Top patents by PatentIndex Score
24 records- 0192US8778735B1Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2013·Granted Jul 15, 2014·14 cites·10 claims
- 0291US9437528B1Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereofALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2015·Granted Sep 6, 2016·15 cites·19 claims
- 0390US8952509B1Stacked multi-chip bottom source semiconductor device and preparation method thereofYILMAZ HAMZA·Filed 2013·Granted Feb 10, 2015·15 cites·15 claims
- 0486US8642397B1Semiconductor wafer level package (WLP) and method of manufacture thereofGONG YUPING·Filed 2012·Granted Feb 4, 2014·9 cites·20 claims
- 0585US8841167B1Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFETGONG YUPING·Filed 2013·Granted Sep 23, 2014·8 cites·8 claims
- 0685US8563361B2Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2012·Granted Oct 22, 2013·8 cites·8 claims
- 0785US8519520B2Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing methodGONG YUPING·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 0885US8338232B2Power semiconductor device package methodSHI LEI·Filed 2011·Granted Dec 25, 2012·8 cites·15 claims
- 0983US8486803B2Wafer level packaging method of encapsulating the bottom and side of a semiconductor chipHUANG PING·Filed 2011·Granted Jul 16, 2013·8 cites·7 claims
- 1082US8163601B2Chip-exposed semiconductor device and its packaging methodGONG YUPING·Filed 2010·Granted Apr 24, 2012·6 cites·11 claims
- 1181US8987878B2Substrateless power device packagesFENG TAO·Filed 2010·Granted Mar 24, 2015·5 cites·7 claims
- 1281US8344499B2Chip-exposed semiconductor deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2012·Granted Jan 1, 2013·5 cites·4 claims
- 1376US8236613B2Wafer level chip scale package method using clip arrayGONG YUPING·Filed 2010·Granted Aug 7, 2012·4 cites·13 claims
- 1474US9196534B2Method for preparing semiconductor devices applied in flip chip technologyALPHA & OMEGA SEMICONDUCTOR·Filed 2013·Granted Nov 24, 2015·4 cites·16 claims
- 1572US8877555B2Flip-chip semiconductor chip packing methodSHI LEI·Filed 2012·Granted Nov 4, 2014·3 cites·18 claims
- 1666US8933545B2Double-side exposed semiconductor deviceALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2013·Granted Jan 13, 2015·2 cites·7 claims
- 1765US9136154B2Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Sep 15, 2015·1 cites·7 claims
- 1862US2025286029A1Semiconductor deviceSUZHOU NOVOSENSE MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1951US9006901B2Thin power device and preparation method thereofGONG YUPING·Filed 2013·Granted Apr 14, 2015·0 cites·6 claims
- 2047US9854686B2Preparation method of a thin power deviceALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2015·Granted Dec 26, 2017·0 cites·6 claims
- 2147US2012267787A1Wafer Level Chip Scale Package Method Using Clip ArrayGONG YUPING·Filed 2012·Application pending·0 cites
- 2247US2015340301A1Substrateless power device packagesALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Application pending·0 cites
- 2342US8450152B2Double-side exposed semiconductor device and its manufacturing methodGONG YUPING·Filed 2011·Granted May 28, 2013·0 cites·15 claims
- 2439US11133128B2System in package module assembly, system in package module, and electronic deviceHUAWEI TECH CO LTD·Filed 2018·Granted Sep 28, 2021·0 cites·10 claims
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