Inventor · disambiguated record
Masahiro Aoyagi
Also filed as: AOYAGI MASAHIRO
19 granted patents·2 pending applications·93 citations·filing 1991–2019
93Inventor score
Files withNAT INST OF ADVANCED IND SCIEN5AIST3AGENCY IND SCIENCE TECHN2KIYOTA MFG CO2TRECENTI TECHNOLOGIES INC2
Top patents by PatentIndex Score
21 records- 0182US7990165B2Contact probe and method of making the sameNAT INST OF ADVANCED IND SCIEN·Filed 2007·Granted Aug 2, 2011·10 cites·4 claims
- 0278US9627347B2Method of manufacturing semiconductor device and semiconductor device manufacturing apparatusNAT INST ADVANCED IND SCIENCE & TECH·Filed 2013·Granted Apr 18, 2017·8 cites·14 claims
- 0378US9345145B2Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using sameIWAI RYOTA·Filed 2010·Granted May 17, 2016·3 cites·13 claims
- 0477US7234998B2Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor deviceTRECENTI TECHNOLOGIES INC·Filed 2005·Granted Jun 26, 2007·4 cites·5 claims
- 0576US7323348B2Superconducting integrated circuit and method for fabrication thereofNAT INST OF ADVANCED IND SCIEN·Filed 2005·Granted Jan 29, 2008·7 cites·5 claims
- 0675US8367468B2Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the sameNAT INST OF ADVANCED IND SCIEN·Filed 2011·Granted Feb 5, 2013·3 cites·11 claims
- 0773US7208966B2Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probeKIYOTA MFG CO·Filed 2005·Granted Apr 24, 2007·7 cites·7 claims
- 0872US9818645B2Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereofAIST·Filed 2016·Granted Nov 14, 2017·2 cites·4 claims
- 0967US7227352B2Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probeKIYOTA MFG CO·Filed 2006·Granted Jun 5, 2007·5 cites·2 claims
- 1065US7833835B2Multi-layer fin wiring interposer fabrication processNAT INST OF ADVANCED IND SCIEN·Filed 2007·Granted Nov 16, 2010·3 cites·4 claims
- 1162US8399979B2Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the sameYAMAJI YASUHIRO·Filed 2007·Granted Mar 19, 2013·3 cites·21 claims
- 1259US6911665B2Superconducting integrated circuit and method for fabrication thereofPI R & D CO LTD·Filed 2003·Granted Jun 28, 2005·5 cites·5 claims
- 1356US7767574B2Method of forming micro metal bumpMIKUNI KOGYO KK·Filed 2007·Granted Aug 3, 2010·2 cites·9 claims
- 1454US5598105AElementary cell for constructing asynchronous superconducting logic circuitsAGENCY IND SCIENCE TECHN·Filed 1995·Granted Jan 28, 1997·15 cites·12 claims
- 1553US7414422B2System in-package test inspection apparatus and test inspection methodNAT INST OF ADVANCED IND SCIEN·Filed 2005·Granted Aug 19, 2008·2 cites·5 claims
- 1647US5260264AJosephson memory circuitAGENCY IND SCIENCE TECHN·Filed 1991·Granted Nov 9, 1993·14 cites·11 claims
- 1743US2004203321A1Manufacturing method of semiconductor device, automatic operation method and automatic operation system of semiconductor manufacturing apparatus, and automatic operation method of CMP apparatusTRECENTI TECHNOLOGIES INC·Filed 2004·Application pending·0 cites
- 1841US9984956B2Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereofAIST·Filed 2015·Granted May 29, 2018·0 cites·11 claims
- 1940US11270968B2Electronic circuit connection method and electronic circuitAIST·Filed 2019·Granted Mar 8, 2022·0 cites·11 claims
- 2039US9134346B2Method of making contact probeAOYAGI MASAHIRO·Filed 2011·Granted Sep 15, 2015·0 cites·15 claims
- 2139US2004256727A1Multi-layer fine wiring interposer and manufacturing method thereofFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →