Inventor · disambiguated record
Chih-Cherng Jeng
Also filed as: JENG CHIH-CHERNG
9 granted patents·1 pending application·20 citations·filing 2004–2012
82Inventor score
Top patents by PatentIndex Score
10 records- 0180US8803271B2Structures for grounding metal shields in backside illumination image sensor chipsLIU ZHE-JU·Filed 2012·Granted Aug 12, 2014·4 cites·20 claims
- 0276US8652868B2Implanting method for forming photodiodeSHIH YU-SHEN·Filed 2012·Granted Feb 18, 2014·3 cites·20 claims
- 0373US8628998B2Annealing methods for backside illumination image sensor chipsLIN YU-TING·Filed 2012·Granted Jan 14, 2014·3 cites·16 claims
- 0464US8872301B2Dual profile shallow trench isolation apparatus and systemHUNG CHIA-YANG·Filed 2012·Granted Oct 28, 2014·3 cites·20 claims
- 0562US8889461B2CIS image sensors with epitaxy layers and methods for forming the sameJANGJIAN SHIU-KO·Filed 2012·Granted Nov 18, 2014·1 cites·21 claims
- 0655US7777338B2Seal ring structure for integrated circuit chipsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 17, 2010·6 cites·50 claims
- 0749US8860101B2Image sensor cross-talk reduction systemCHANG LAN FANG·Filed 2012·Granted Oct 14, 2014·0 cites·20 claims
- 0848US8951826B2Method for increasing photodiode full well capacityJENG JUNG-CHI·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 0947US8049213B2Feature dimension measurementTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·0 cites·9 claims
- 1043US2006055002A1Methods for enhancing die saw and packaging reliabilityTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →