Inventor · disambiguated record
Hisashi Minoura
Also filed as: MINOURA HISASHI
11 granted patents·1 pending application·302 citations·filing 1998–2012
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0193US7612295B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Nov 3, 2009·26 cites·4 claims
- 0289US6590165B1Printed wiring board having throughole and annular landsIBIDEN CO LTD·Filed 1998·Granted Jul 8, 2003·99 cites·5 claims
- 0384US6555208B2Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2001·Granted Apr 29, 2003·27 cites·14 claims
- 0477US7552531B2Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuitIBIDEN CO LTD·Filed 2003·Granted Jun 30, 2009·22 cites·5 claims
- 0577US6284353B1Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 1999·Granted Sep 4, 2001·35 cites·4 claims
- 0676US6232558B1Electronic component mounting base board having heat slug with slits and projectionsIBIDEN CO LTD·Filed 1998·Granted May 15, 2001·53 cites·7 claims
- 0767US7765692B2Method of manufacturing printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Aug 3, 2010·2 cites·4 claims
- 0865US6986917B2Printed wiring board and method of manufacturing the sameIBIDEN CO LTD·Filed 2003·Granted Jan 17, 2006·8 cites·10 claims
- 0962US7594320B2Method of manufacturing printed wiring boardIBIDEN CO LTD·Filed 2005·Granted Sep 29, 2009·1 cites·13 claims
- 1055US7339118B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted Mar 4, 2008·18 cites·9 claims
- 1143US6455783B1Multilayer printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted Sep 24, 2002·11 cites·15 claims
- 1238US2013048355A1Printed wiring boardFURUTA TORU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →