Inventor · disambiguated record
Yukitsuna Konishi
Also filed as: KONISHI YUKITSUNA
3 granted patents·91 citations·filing 1997–2008
74Inventor score
Top patents by PatentIndex Score
3 records- 0191US6303219B1Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for tab, adhesive-backed tape for wire-bonding connection, semiconductor connecting substrate, and semiconductor deviceTORAY INDUSTRIES·Filed 1997·Granted Oct 16, 2001·71 cites·23 claims
- 0277US8138580B2Adhesive composition for electronic components, and adhesive sheet for electronic components using the sameKONISHI YUKITSUNA·Filed 2008·Granted Mar 20, 2012·7 cites·15 claims
- 0377US6716529B2Adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, adhesive-backed tape for wire bonding connection, semiconductor connecting substrate and semiconductor deviceTORAY INDUSTRIES·Filed 2001·Granted Apr 6, 2004·13 cites·34 claims
Join the waitlist — get patent alerts
Get an alert when Yukitsuna Konishi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →