Inventor · disambiguated record
Julius C. Fister
Also filed as: BREEDIS JOHN F · COX LEON · FISTER JR JULIUS C · FISTER JULIUS
43 granted patents·1,546 citations·filing 1977–2004
99Inventor score
Top patents by PatentIndex Score
43 records- 0197US4749626AWhisker resistant tin coatings and baths and methods for making such coatingsOLIN CORP·Filed 1986·Granted Jun 7, 1988·78 cites·18 claims
- 0294US6346335B1Copper foil composite including a release layerOLIN CORP·Filed 2000·Granted Feb 12, 2002·93 cites·35 claims
- 0393US5078054AFrangible projectileOLIN CORP·Filed 1989·Granted Jan 7, 1992·52 cites·4 claims
- 0492US4441118AComposite copper nickel alloys with improved solderability shelf lifeOLIN CORP·Filed 1983·Granted Apr 3, 1984·78 cites·15 claims
- 0590US5916695ATin coated electrical connectorOLIN CORP·Filed 1996·Granted Jun 29, 1999·104 cites·8 claims
- 0690US5780172ATin coated electrical connectorOLIN CORP·Filed 1996·Granted Jul 14, 1998·66 cites·15 claims
- 0788US5122858ALead frame having polymer coated surface portionsOLIN CORP·Filed 1990·Granted Jun 16, 1992·113 cites·34 claims
- 0886US5141702AMethod of making coated electrical connectorsOLIN CORP·Filed 1991·Granted Aug 25, 1992·43 cites·15 claims
- 0985US5029529ASemiconductor bridge (SCB) packaging systemOLIN CORP·Filed 1989·Granted Jul 9, 1991·38 cites·6 claims
- 1085US4872047ASemiconductor die attach systemOLIN CORP·Filed 1986·Granted Oct 3, 1989·72 cites·21 claims
- 1184US6797764B2Water-based adhesiveOLIN CORP·Filed 2001·Granted Sep 28, 2004·30 cites·25 claims
- 1283US6183886B1Tin coatings incorporating selected elemental additions to reduce discolorationOLIN CORP·Filed 1998·Granted Feb 6, 2001·50 cites·7 claims
- 1383US5113764ASemiconductor bridge (SCB) packaging systemOLIN CORP·Filed 1991·Granted May 19, 1992·42 cites·25 claims
- 1482US5139890ASilver-coated electrical componentsOLIN CORP·Filed 1991·Granted Aug 18, 1992·45 cites·12 claims
- 1580US5637160ACorrosion-resistant bismuth brassOLIN CORP·Filed 1994·Granted Jun 10, 1997·28 cites·23 claims
- 1679US5139891APalladium alloys having utility in electrical applicationsOLIN CORP·Filed 1991·Granted Aug 18, 1992·38 cites·25 claims
- 1777US6689268B2Copper foil composite including a release layerOLIN CORP·Filed 2001·Granted Feb 10, 2004·21 cites·10 claims
- 1877US6136460ATin coatings incorporating selected elemental additions to reduce discolorationOLIN CORP·Filed 1998·Granted Oct 24, 2000·38 cites·28 claims
- 1977US4113472AHigh strength aluminum extrusion alloyALUSUISSE·Filed 1977·Granted Sep 12, 1978·19 cites·14 claims
- 2076US4498121ACopper alloys for suppressing growth of Cu-Al intermetallic compoundsOLIN CORP·Filed 1983·Granted Feb 5, 1985·37 cites·7 claims
- 2175US6083633AMulti-layer diffusion barrier for a tin coated electrical connectorOLIN CORP·Filed 1997·Granted Jul 4, 2000·41 cites·23 claims
- 2275US5236789APalladium alloys having utility in electrical applicationsOLIN CORP·Filed 1992·Granted Aug 17, 1993·35 cites·5 claims
- 2375US4923583AElectrode elements for filter press membrane electrolytic cellsOLIN CORP·Filed 1985·Granted May 8, 1990·20 cites·33 claims
- 2474US4330599AComposite materialOLIN CORP·Filed 1980·Granted May 18, 1982·30 cites·12 claims
- 2572US4429022AComposite material having improved bond strengthOLIN CORP·Filed 1982·Granted Jan 31, 1984·19 cites·11 claims
- 2671US4166755AAluminum alloy capacitor foil and method of makingALUSUISSE·Filed 1977·Granted Sep 4, 1979·14 cites·16 claims
- 2771US4164434AAluminum alloy capacitor foil and method of makingALUSUISSE·Filed 1977·Granted Aug 14, 1979·14 cites·33 claims
- 2870US4674671AThermosonic palladium lead wire bondingOLIN CORP·Filed 1985·Granted Jun 23, 1987·35 cites·20 claims
- 2970US4500605AElectrical component forming processOLIN CORP·Filed 1983·Granted Feb 19, 1985·30 cites·15 claims
- 3069US5320737ATreatment to reduce solder plating whisker formationOLIN CORP·Filed 1989·Granted Jun 14, 1994·25 cites·4 claims
- 3169US4695359AFilter press membrane electrolytic cell with diffusion bonded electrode elements and elastomeric framesOLIN CORP·Filed 1986·Granted Sep 22, 1987·16 cites·22 claims
- 3267US4929516ASemiconductor die attach systemOLIN CORP·Filed 1986·Granted May 29, 1990·33 cites·6 claims
- 3366US4767049ASpecial surfaces for wire bondingOLIN CORP·Filed 1986·Granted Aug 30, 1988·31 cites·5 claims
- 3459US4649083AElectrical component forming processOLIN CORP·Filed 1984·Granted Mar 10, 1987·20 cites·8 claims
- 3558US4362262AMethod of forming a composite materialOLIN CORP·Filed 1981·Granted Dec 7, 1982·12 cites·9 claims
- 3657US4500028AMethod of forming a composite material having improved bond strengthOLIN CORP·Filed 1983·Granted Feb 19, 1985·23 cites·8 claims
- 3755US6905782B2Tarnish deterring tin coatingOLIN CORP·Filed 2004·Granted Jun 14, 2005·5 cites·16 claims
- 3855US4978052ASemiconductor die attach systemOLIN CORP·Filed 1989·Granted Dec 18, 1990·20 cites·19 claims
- 3948US4625400AMethod of making a strip for an electrical contact terminalOLIN CORP·Filed 1983·Granted Dec 2, 1986·9 cites·8 claims
- 4045US4736882AThermode design for tab and method of useOLIN CORP·Filed 1986·Granted Apr 12, 1988·12 cites·15 claims
- 4145US4214041AComposite aluminum capacitor foilALUSUISSE·Filed 1978·Granted Jul 22, 1980·7 cites·11 claims
- 4240US4822693ACopper-iron-nickel composite material for electrical and electronic applicationsOLIN CORP·Filed 1987·Granted Apr 18, 1989·9 cites·8 claims
- 4329US5017244AProcess for improving the electrical conductivity of a copper-nickel-iron alloyOLIN CORP·Filed 1988·Granted May 21, 1991·1 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →