Inventor · disambiguated record
Takahiro Yurino
Also filed as: YURINO TAKAHIRO
6 granted patents·3 pending applications·398 citations·filing 1997–2012
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0196US5969424ASemiconductor device with pad structureFUJITSU LTD·Filed 1997·Granted Oct 19, 1999·258 cites·11 claims
- 0292US6232147B1Method for manufacturing semiconductor device with pad structureFUJITSU LTD·Filed 1999·Granted May 15, 2001·133 cites·11 claims
- 0378US8664046B2Manufacturing method thereof and a semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2012·Granted Mar 4, 2014·4 cites·7 claims
- 0464US8610253B2Lead frame, semiconductor device, and method of manufacturing semiconductor deviceYURINO TAKAHIRO·Filed 2011·Granted Dec 17, 2013·3 cites·17 claims
- 0545US8940583B2Manufacturing method of a lead frameYURINO TAKAHIRO·Filed 2010·Granted Jan 27, 2015·0 cites·4 claims
- 0643US2008290483A1Semiconductor device, leadframe and structure for mounting semiconductor deviceFUJITSU LTD·Filed 2008·Application pending·0 cites
- 0737US8791555B2Semiconductor device and lead frameYURINO TAKAHIRO·Filed 2011·Granted Jul 29, 2014·0 cites·14 claims
- 0837US2003227073A1Lead frame and manufacturing method thereof and a semiconductor deviceFUJITSU LTD·Filed 2003·Application pending·0 cites
- 0933US2011278708A1Lead frame, semiconductor device, and method for manufacturing semiconductor deviceYURINO TAKAHIRO·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →