Inventor · disambiguated record
Kok Chai Goh
Also filed as: GOH KOK CHAI
8 granted patents·1 pending application·14 citations·filing 2011–2023
80Inventor score
Top patents by PatentIndex Score
9 records- 0183US12255168B2Electronic device with multi-layer contact and systemINFINEON TECHNOLOGIES AG·Filed 2023·Granted Mar 18, 2025·0 cites·10 claims
- 0283US11842975B2Electronic device with multi-layer contact and systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 12, 2023·2 cites·8 claims
- 0379US9490193B2Electronic device with multi-layer contactHEINRICH ALEXANDER·Filed 2011·Granted Nov 8, 2016·4 cites·6 claims
- 0475US9209152B2Molding material and method for packaging semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 8, 2015·5 cites·23 claims
- 0570US9054063B2High power single-die semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 9, 2015·3 cites·13 claims
- 0659US10475761B2Method for producing electronic device with multi-layer contactINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 12, 2019·0 cites·20 claims
- 0754US2017025375A1Electronic Device with Multi-Layer ContactINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 0844US9275944B2Semiconductor package with multi-level die blockINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·0 cites·26 claims
- 0935US9373609B2Bump package and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jun 21, 2016·0 cites·27 claims
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