Inventor · disambiguated record
Romel N. Manatad
Also filed as: MANATAD ROMEL · MANATAD ROMEL N · MANATAD Romel Nogas
28 granted patents·5 pending applications·728 citations·filing 1999–2024
97Inventor score
Files withFAIRCHILD SEMICONDUCTOR20SEMICONDUCTOR COMPONENTS IND LLC8KIM SUKU2MADRID RUBEN1MADRID RUBEN P1
Top patents by PatentIndex Score
33 records- 0198US7215011B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted May 8, 2007·65 cites·20 claims
- 0296US7256479B2Method to manufacture a universal footprint for a package with exposed chipFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Aug 14, 2007·62 cites·17 claims
- 0396US6943434B2Method for maintaining solder thickness in flipchip attach packaging processesFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 13, 2005·133 cites·24 claims
- 0495US6720642B1Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 1999·Granted Apr 13, 2004·137 cites·7 claims
- 0594US7154168B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Dec 26, 2006·64 cites·12 claims
- 0693US11791247B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Oct 17, 2023·2 cites·20 claims
- 0793US7122884B2Robust leaded molded packages and methods for forming the sameFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Oct 17, 2006·106 cites·12 claims
- 0892US7906837B2Robust leaded molded packages and methods for forming the sameFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Mar 15, 2011·28 cites·20 claims
- 0992US7217594B2Alternative flip chip in leaded molded package design and method for manufactureFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted May 15, 2007·63 cites·15 claims
- 1086US7586178B2Alternative flip chip in leaded molded package design and method for manufactureFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 8, 2009·12 cites·20 claims
- 1185US11088046B2Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 10, 2021·3 cites·11 claims
- 1284US6949410B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Sep 27, 2005·24 cites·20 claims
- 1383US7816784B2Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Oct 19, 2010·12 cites·24 claims
- 1479US2024363471A1Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1578US7576429B2Packaged semiconductor device with dual exposed surfaces and method of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Aug 18, 2009·7 cites·7 claims
- 1676US12300583B2Concealed gate terminal semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1775US2024429136A1Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 1872US11735508B2Vertical and horizontal circuit assembliesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 1972US7582956B2Flip chip in leaded molded package and method of manufacture thereofFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 1, 2009·3 cites·9 claims
- 2070US12051635B2Semiconductor device package with clip interconnect and dual side coolingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 30, 2024·0 cites·17 claims
- 2170US7560311B2Robust leaded molded packages and methods for forming the sameFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Jul 14, 2009·4 cites·25 claims
- 2261US12087677B2Molded packaging for wide band gap semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Sep 10, 2024·0 cites·13 claims
- 2360US8158506B2Methods and designs for localized wafer thinningKIM SUKU·Filed 2008·Granted Apr 17, 2012·2 cites·18 claims
- 2460US7816178B2Packaged semiconductor device with dual exposed surfaces and method of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Oct 19, 2010·1 cites·7 claims
- 2559US11177203B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 2658US11296069B2Substrate interposer on a leaderframeFAIRCHILD SEMICONDUCTOR·Filed 2020·Granted Apr 5, 2022·0 cites·16 claims
- 2755US10256178B2Vertical and horizontal circuit assembliesFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
- 2851US2010164078A1Package assembly for semiconductor devicesMADRID RUBEN·Filed 2008·Application pending·0 cites
- 2947US8624393B2Methods and designs for localized wafer thinningKIM SUKU·Filed 2012·Granted Jan 7, 2014·0 cites·19 claims
- 3046US10546847B2Substrate interposer on a leadframeFAIRCHILD SEMICONDUCTOR·Filed 2016·Granted Jan 28, 2020·0 cites·22 claims
- 3145US2005224940A1Method for maintaining solder thickness in flipchip attach packaging processesTANGPUZ CONSUELO N·Filed 2005·Application pending·0 cites
- 3245US2011244633A1Package assembly for semiconductor devicesMADRID RUBEN P·Filed 2011·Application pending·0 cites
- 3333US9698143B2Wireless module with active devicesFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Jul 4, 2017·0 cites·20 claims
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