Inventor · disambiguated record
Beng Keh See
Also filed as: SEE BENG KEH
9 granted patents·1 pending application·34 citations·filing 2008–2019
85Inventor score
Top patents by PatentIndex Score
10 records- 0188US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0288US8749056B2Module and method of manufacturing a moduleKEHRER DANIEL·Filed 2011·Granted Jun 10, 2014·11 cites·23 claims
- 0384US10396007B2Semiconductor package with plateable encapsulant and a method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 27, 2019·4 cites·13 claims
- 0482US8535983B2Method of manufacturing a semiconductor deviceHIN TZE YANG·Filed 2011·Granted Sep 17, 2013·9 cites·7 claims
- 0571US11081417B2Manufacturing a package using plateable encapsulantINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·1 cites·17 claims
- 0670US9691687B2Module and method of manufacturing a moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 27, 2017·2 cites·16 claims
- 0760US8722462B2Semiconductor packageELIAN KLAUS·Filed 2010·Granted May 13, 2014·1 cites·26 claims
- 0857US8053280B2Method of producing multiple semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 8, 2011·2 cites·17 claims
- 0943US9653405B2Chip arrangement and a method of manufacturing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 16, 2017·0 cites·13 claims
- 1029US2012273935A1Semiconductor Device and Method of Making a Semiconductor DeviceMARTENS STEFAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →