Inventor · disambiguated record
Osamu Matsuzawa
Also filed as: MATSUZAWA OSAMU
10 granted patents·52 citations·filing 1994–2021
86Inventor score
Files withSEIKO INSTR INC3TANAKA ELECTRONICS IND2TANAKA PRECIOUS METAL IND2HITACHI HIGH TECH SCIENCE CORP1NIHEI AMIKO1
Top patents by PatentIndex Score
10 records- 0177US6432157B1Method for preparing Ag-ZnO electric contact material and electric contact material produced therebyTANAKA PRECIOUS METAL IND·Filed 2000·Granted Aug 13, 2002·12 cites·6 claims
- 0269US9500524B2ICP emission spectrometerHITACHI HIGH-TECH SCIENCE CORP·Filed 2015·Granted Nov 22, 2016·1 cites·4 claims
- 0368US6002129AInductively coupled plasma mass spectrometric and spectrochemical analyzerSEIKO INSTR INC·Filed 1998·Granted Dec 14, 1999·21 cites·2 claims
- 0461US7456400B2Scanning probe microscope and scanning methodSEIKO INSTR INC·Filed 2005·Granted Nov 25, 2008·7 cites·18 claims
- 0560US11996382B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted May 28, 2024·0 cites·15 claims
- 0659US7823470B2Cantilever and cantilever manufacturing methodSEIKO INSTR INC·Filed 2007·Granted Nov 2, 2010·3 cites·7 claims
- 0757US6514630B2Au-based clad composite material, producing method thereof and micromotor using the sameSANKYO SEIKI SEISAKUSHO KK·Filed 2001·Granted Feb 4, 2003·3 cites·7 claims
- 0849US12237293B2Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereofTANAKA ELECTRONICS IND·Filed 2021·Granted Feb 25, 2025·0 cites·13 claims
- 0945US8859279B2Cell detachment methodNIHEI AMIKO·Filed 2007·Granted Oct 14, 2014·0 cites·17 claims
- 1035US5531371AProcess of preparing clad contact materialTANAKA PRECIOUS METAL IND·Filed 1994·Granted Jul 2, 1996·5 cites·2 claims
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