Inventor · disambiguated record
Kanji Shimo-Ohsako
Also filed as: SHIMO-OHSAKO KANJI
4 granted patents·3 pending applications·55 citations·filing 2001–2008
77Inventor score
Top patents by PatentIndex Score
7 records- 0188US7115681B2Resin compositionKANEKA CORP·Filed 2002·Granted Oct 3, 2006·29 cites·8 claims
- 0279US7101619B2LaminateKANEKA CORP·Filed 2005·Granted Sep 5, 2006·9 cites·5 claims
- 0369US8313831B2Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of sameTANAKA SHIGERU·Filed 2003·Granted Nov 20, 2012·6 cites·4 claims
- 0467US6911265B2LaminateKANEKA CORP·Filed 2001·Granted Jun 28, 2005·11 cites·15 claims
- 0560US2008312383A1Thermosetting Resin Composition, And Laminate and Circuit Substrate Using SameKANEKA CORP·Filed 2008·Application pending·0 cites
- 0646US2005119381A1Thermosetting resin composition and laminates and circuit board substrates made by using the sameFiled 2003·Application pending·0 cites
- 0735US2004231141A1Laminate and its producing methodFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →