Inventor · disambiguated record
Lien-Chi Chan
Also filed as: CHAN LIEN-CHI
7 granted patents·175 citations·filing 2000–2004
88Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD7
Top patents by PatentIndex Score
7 records- 0190USD529031SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 26, 2006·41 cites·1 claims
- 0285US6847104B2Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jan 25, 2005·42 cites·17 claims
- 0380US6359342B1Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 19, 2002·37 cites·10 claims
- 0479USD492314SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 29, 2004·24 cites·1 claims
- 0569US6538321B2Heat sink with collapse structure and semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 25, 2003·14 cites·10 claims
- 0660US7339280B2Semiconductor package with lead frame as chip carrier and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Mar 4, 2008·10 cites·13 claims
- 0758US6858931B2Heat sink with collapse structure for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Feb 22, 2005·7 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →