Inventor · disambiguated record
Hyun-Bo Shin
Also filed as: SHIN HYUN BO
5 granted patents·1 pending application·131 citations·filing 1997–2010
81Inventor score
Top patents by PatentIndex Score
6 records- 0191US6385020B1Methods of forming HSG capacitors from nonuniformly doped amorphous silicon layers and HSG capacitors formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 7, 2002·69 cites·15 claims
- 0268US6238968B1Methods of forming integrated circuit capacitors having protected layers of HSG silicon thereinSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted May 29, 2001·18 cites·20 claims
- 0360US5854095ADual source gas methods for forming integrated circuit capacitor electrodesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Dec 29, 1998·27 cites·28 claims
- 0456US5885867AMethods of forming hemispherical grained silicon layers including anti-nucleation gasesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Mar 23, 1999·17 cites·30 claims
- 0532US2012125588A1Heat dissipation plate for projection-type ic packageNAM DONG JIN·Filed 2010·Application pending·0 cites
- 0628US6284632B1Method for manufacturing semiconductor device with stagnated process gasSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Sep 4, 2001·0 cites·4 claims
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