Inventor · disambiguated record
Tooru Mochida
Also filed as: MOCHIDA TOORU
22 granted patents·315 citations·filing 1992–2001
96Inventor score
Files withSHINKAWA KK22
Top patents by PatentIndex Score
22 records- 0177US6619530B2Wire bonding apparatusSHINKAWA KK·Filed 2001·Granted Sep 16, 2003·26 cites·4 claims
- 0271US5989995ASemiconductor device and wire bonding method thereforSHINKAWA KK·Filed 1997·Granted Nov 23, 1999·40 cites·4 claims
- 0369US5961029AWire bonding methodSHINKAWA KK·Filed 1998·Granted Oct 5, 1999·37 cites·2 claims
- 0465US6213384B1Wire bonding methodSHINKAWA KK·Filed 2000·Granted Apr 10, 2001·11 cites·1 claims
- 0563US6222274B1Bonding wire loop shape for a semiconductor deviceSHINKAWA KK·Filed 1998·Granted Apr 24, 2001·24 cites·2 claims
- 0662US5967401AWire bonding methodSHINKAWA KK·Filed 1997·Granted Oct 19, 1999·26 cites·3 claims
- 0760US6045318ALead frame supplying method and apparatusSHINKAWA KK·Filed 1997·Granted Apr 4, 2000·24 cites·2 claims
- 0859US5364009AUltrasonic wire bonding methodSHINKAWA KK·Filed 1993·Granted Nov 15, 1994·26 cites·2 claims
- 0958US6595400B2Wire bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 22, 2003·8 cites·3 claims
- 1058US6467678B2Wire bonding method and apparatusSHINKAWA KK·Filed 2000·Granted Oct 22, 2002·9 cites·10 claims
- 1158US6080651AWire bonding methodSHINKAWA KK·Filed 1998·Granted Jun 27, 2000·22 cites·5 claims
- 1251US6502738B2Wire bonding apparatusSHINKAWA KK·Filed 2000·Granted Jan 7, 2003·4 cites·3 claims
- 1345US6343733B1Wire bonding methodSHINKAWA KK·Filed 1999·Granted Feb 5, 2002·12 cites·2 claims
- 1440US6250539B1Wire bonding methodSHINKAWA KK·Filed 1999·Granted Jun 26, 2001·8 cites·4 claims
- 1540US6001670ALead frame supplying methodSHINKAWA KK·Filed 1997·Granted Dec 14, 1999·7 cites·2 claims
- 1639US5207370AWire bonding method and apparatusSHINKAWA KK·Filed 1992·Granted May 4, 1993·11 cites·8 claims
- 1736US5219112AWire bonding apparatusSHINKAWA KK·Filed 1992·Granted Jun 15, 1993·9 cites·3 claims
- 1834US5524811AWire bonding methodSHINKAWA KK·Filed 1994·Granted Jun 11, 1996·5 cites·7 claims
- 1932US6033932ALead frame supplying apparatusSHINKAWA KK·Filed 1999·Granted Mar 7, 2000·1 cites·2 claims
- 2031US5386936AWire bonding methodSHINKAWA KK·Filed 1993·Granted Feb 7, 1995·3 cites·2 claims
- 2130US5287064ABonding point polarity determining apparatusSHINKAWA KK·Filed 1992·Granted Feb 15, 1994·0 cites·2 claims
- 2229US5485063AMotor control circuit for a wire bonding apparatusSHINKAWA KK·Filed 1993·Granted Jan 16, 1996·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →