Inventor · disambiguated record
Teruo Kusaka
Also filed as: KUSAKA TERUO
7 granted patents·359 citations·filing 1984–1998
88Inventor score
Files withNEC CORP7
Top patents by PatentIndex Score
7 records- 0190US5600180ASealing structure for bumps on a semiconductor integrated circuit chipNEC CORP·Filed 1995·Granted Feb 4, 1997·129 cites·30 claims
- 0270US5297333APackaging method for flip-chip type semiconductor deviceNEC CORP·Filed 1992·Granted Mar 29, 1994·47 cites·9 claims
- 0369US6201346B1EL display device using organic EL element having a printed circuit boardNEC CORP·Filed 1998·Granted Mar 13, 2001·91 cites·9 claims
- 0462US5367765AMethod of fabricating integrated circuit chip packageNEC CORP·Filed 1992·Granted Nov 29, 1994·34 cites·9 claims
- 0548US5896006AOrganic thin film light-emitting device having second electrodes layer covering periphery of first electrodes layerNEC CORP·Filed 1997·Granted Apr 20, 1999·42 cites·4 claims
- 0647US6025610ASolid relay and method of producing the sameNEC CORP·Filed 1998·Granted Feb 15, 2000·15 cites·10 claims
- 0729US4694319AThyristor having a controllable gate trigger currentNEC CORP·Filed 1984·Granted Sep 15, 1987·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →