Inventor · disambiguated record
Bharatwaj Ramakrishnan
Also filed as: RAMAKRISHNAN BHARATWAJ
4 granted patents·10 pending applications·1 citations·filing 2007–2024
57Inventor score
Top patents by PatentIndex Score
14 records- 0182US11489105B2Physical vapor deposition of piezoelectric filmsAPPLIED MATERIALS INC·Filed 2019·Granted Nov 1, 2022·1 cites·16 claims
- 0270US12201025B2Physical vapor deposition of piezoelectric filmsAPPLIED MATERIALS INC·Filed 2022·Granted Jan 14, 2025·0 cites·18 claims
- 0362US2025207248A1Nanocrystalline diamond and ultra-nanocrystalline diamond films by catalytic cvdAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0460US2023257868A1Apparatus and method for fabricating pvd perovskite filmsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0550US2022213590A1Methods and apparatus for processing a substrate using improved shield configurationsAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 0649US2025133965A1Selective etching of scandium-doped aluminum nitrideAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0747US2024016060A1Selective laser patterning on piezoelectric thin films for piezoelectric device fabricationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0845US9911910B2High temperature superconductor tape with alloy metal coatingVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2013·Granted Mar 6, 2018·0 cites·14 claims
- 0941US2022320417A1Method of manufacturing aluminum nitride filmsAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1040US9768370B2Low AC loss high temperature superconductor tapeVARIAN SEMICONDUCTOR EQUIPMENT ASS INC·Filed 2013·Granted Sep 19, 2017·0 cites·10 claims
- 1139US2024114800A1Deposition Of Piezoelectric FilmsAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 1238US2021143320A1Fabrication of piezoelectric device with pmnpt layerAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1338US2023320223A1Deposition methods and apparatus for piezoelectric applicationsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 1437US2009051043A1Die stacking in multi-die stacks using die support mechanismsSPANSION LLC·Filed 2007·Application pending·0 cites
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