Inventor · disambiguated record
Maik Stegemann
Also filed as: STEGEMANN MAIK
35 granted patents·6 pending applications·50 citations·filing 2001–2025
95Inventor score
Files withINFINEON TECHNOLOGIES DRESDEN GMBH18INFINEON TECHNOLOGIES AG12INFINEON TECH DRESDEN GMBH & CO KG5INFINEON TECHNOLOGIES AUSTRIA AG2STEGEMANN MAIK1
Top patents by PatentIndex Score
41 records- 0195US9382111B2Micromechanical system and method for manufacturing a micromechanical systemINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted Jul 5, 2016·13 cites·15 claims
- 0288US9330929B1Systems and methods for horizontal integration of acceleration sensor structuresINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted May 3, 2016·8 cites·12 claims
- 0383US11422151B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 23, 2022·1 cites·21 claims
- 0483US10681777B2Light emitter devices, optical filter structures and methods for forming light emitter devices and optical filter structuresINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 9, 2020·2 cites·19 claims
- 0579US7141507B2Method for production of a semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 28, 2006·9 cites·14 claims
- 0678US10683203B2Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS processINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jun 16, 2020·1 cites·18 claims
- 0776US12332271B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jun 17, 2025·0 cites·13 claims
- 0876US2025349615A1Method for Producing a Power Semiconductor Component Having a Contact HoleINFINEON TECH DRESDEN GMBH & CO KG·Filed 2025·Application pending·0 cites
- 0975US10870575B2Stressed decoupled micro-electro-mechanical system sensorINFINEON TECH DRESDEN GMBH & CO KG·Filed 2018·Granted Dec 22, 2020·2 cites·20 claims
- 1072US9376314B2Method for manufacturing a micromechanical systemINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jun 28, 2016·2 cites·21 claims
- 1171US9546923B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jan 17, 2017·3 cites·19 claims
- 1270US10684306B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 16, 2020·1 cites·20 claims
- 1369US12137500B2Light emitter devices, optical filter structures and methods for forming light emitter devices and optical filter structuresINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 5, 2024·0 cites·20 claims
- 1469US9887355B2Emitter and method for manufacturing the sameINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Feb 6, 2018·1 cites·22 claims
- 1563US11545561B2Methods for manufacturing a MOSFETINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Jan 3, 2023·0 cites·9 claims
- 1663US11078072B2Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS processINFINEON TECH DRESDEN GMBH & CO KG·Filed 2020·Granted Aug 3, 2021·0 cites·18 claims
- 1760US10544037B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 1860US10290805B2Emitter and method for manufacturing the sameINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted May 14, 2019·0 cites·20 claims
- 1959US10060816B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Aug 28, 2018·0 cites·19 claims
- 2058US10347778B2Graded-index structure for optical systemsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 9, 2019·0 cites·20 claims
- 2157US9896329B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Feb 20, 2018·0 cites·19 claims
- 2256US7368390B2Photolithographic patterning process using a carbon hard mask layer of diamond-like hardness produced by a plasma-enhanced deposition processINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 6, 2008·6 cites·10 claims
- 2356US2023332969A1Pressure Sensing DeviceINFINEON TECH DRESDEN GMBH & CO KG·Filed 2023·Application pending·0 cites
- 2454US11594654B2Method of generating a germanium structure and optical device comprising a germanium structureINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 28, 2023·0 cites·16 claims
- 2554US10903341B2Methods for manufacturing a MOSFETINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jan 26, 2021·0 cites·10 claims
- 2654US10084101B2Graded-index structure for optical systemsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Sep 25, 2018·0 cites·21 claims
- 2754US9209778B2Microelectromechanical resonatorsINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2013·Granted Dec 8, 2015·0 cites·11 claims
- 2853US9136136B2Method and structure for creating cavities with extreme aspect ratiosINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2013·Granted Sep 15, 2015·0 cites·9 claims
- 2952US12406883B2Contact holeINFINEON TECH DRESDEN GMBH & CO KG·Filed 2018·Granted Sep 2, 2025·0 cites·31 claims
- 3052US9663355B2Method and structure for creating cavities with extreme aspect ratiosINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted May 30, 2017·0 cites·9 claims
- 3150US11393714B2Producing a buried cavity in a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 19, 2022·0 cites·14 claims
- 3250US10386255B2Pressure sensor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Aug 20, 2019·0 cites·26 claims
- 3350US9752943B2Sensor structures, systems and methods with improved integration and optimized footprintINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Sep 5, 2017·0 cites·19 claims
- 3450US9641153B2Method of forming a resonatorINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted May 2, 2017·0 cites·19 claims
- 3547US2016185594A1Systems and methods for horizontal integration of acceleration sensor structuresINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Application pending·0 cites
- 3643US9452923B2Method for manufacturing a micromechanical system comprising a removal of sacrificial material through a hole in a margin regionINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2012·Granted Sep 27, 2016·0 cites·21 claims
- 3739US8962469B2Methods of stripping resist after metal depositionSTEGEMANN MAIK·Filed 2012·Granted Feb 24, 2015·0 cites·45 claims
- 3839US7396749B2Method for contacting parts of a component integrated into a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 8, 2008·1 cites·14 claims
- 3939US2004192060A1Method for fabricating a semiconductor structureFiled 2004·Application pending·0 cites
- 4036US2002011462A1Method of processing organic antireflection layersFiled 2001·Application pending·0 cites
- 4128US2005090114A1Method for the production of a semiconductor deviceFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →