Inventor · disambiguated record
Tzu-Hsiang Hung
Also filed as: HUNG TZU-HSIANG
10 granted patents·4 pending applications·32 citations·filing 2011–2018
86Inventor score
Files withHIWIN MIKROSYSTEM CORP4UNITED MICROELECTRONICS CORP3LIN CHIA-SHENG2XINTEC INC2HUANG YU-LUNG1
Top patents by PatentIndex Score
14 records- 0179US8692358B2Image sensor chip package and method for forming the sameHUANG YU-LUNG·Filed 2011·Granted Apr 8, 2014·5 cites·8 claims
- 0275US8742564B2Chip package and method for forming the sameLOU BAI-YAO·Filed 2012·Granted Jun 3, 2014·4 cites·18 claims
- 0374US9404816B1Multifunctional load test deviceHIWIN MIKROSYSTEM CORP·Filed 2015·Granted Aug 2, 2016·2 cites·4 claims
- 0473US8878367B2Substrate structure with through viasLIN CHIA-SHENG·Filed 2011·Granted Nov 4, 2014·4 cites·19 claims
- 0570US9293394B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Mar 22, 2016·2 cites·28 claims
- 0666US9443726B1Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·1 cites·20 claims
- 0759USD784431SMotorHIWIN MIKROSYSTEM CORP·Filed 2015·Granted Apr 18, 2017·10 cites·1 claims
- 0859US8786093B2Chip package and method for forming the sameLIN CHIA-SHENG·Filed 2012·Granted Jul 22, 2014·1 cites·20 claims
- 0954US8779452B2Chip packageHUNG TZU-HSIANG·Filed 2011·Granted Jul 15, 2014·1 cites·21 claims
- 1051US2014154830A1Image sensor chip package and method for forming the sameXINTEC INC·Filed 2014·Application pending·0 cites
- 1147US2016351674A1Semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1236US2020185597A1Memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1333USD784430SIndustrial robot moduleHIWIN MIKROSYSTEM CORP·Filed 2015·Granted Apr 18, 2017·2 cites·1 claims
- 1431US2017217015A1Industrial robotHIWIN MIKROSYSTEM CORP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →