Inventor · disambiguated record
Kotaro Kodani
Also filed as: KODANI KOTARO
24 granted patents·7 pending applications·169 citations·filing 1995–2025
95Inventor score
Top patents by PatentIndex Score
31 records- 0195US8458900B2Wiring substrate having columnar protruding partKODANI KOTARO·Filed 2010·Granted Jun 11, 2013·28 cites·13 claims
- 0293US9210808B2Wiring substrate and method of manufacturing the sameKANEKO KENTARO·Filed 2012·Granted Dec 8, 2015·17 cites·18 claims
- 0392US8797757B2Wiring substrate and manufacturing method thereofKANEKO KENTARO·Filed 2012·Granted Aug 5, 2014·16 cites·5 claims
- 0492US8476754B2Wiring substrate and method of manufacturing the sameKODANI KOTARO·Filed 2010·Granted Jul 2, 2013·14 cites·9 claims
- 0589US8749046B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Jun 10, 2014·8 cites·14 claims
- 0686US8153902B2Wiring board and electronic component deviceNAKAMURA JUNICHI·Filed 2009·Granted Apr 10, 2012·11 cites·6 claims
- 0783US9257373B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 9, 2016·4 cites·6 claims
- 0882US9018538B2Wiring substrate having columnar protruding partSHINKO ELECTRIC IND CO·Filed 2013·Granted Apr 28, 2015·5 cites·5 claims
- 0982US8790504B2Method of manufacturing wiring substrateKODANI KOTARO·Filed 2010·Granted Jul 29, 2014·7 cites·19 claims
- 1082US8686298B2Wiring board and electronic component deviceNAKAMURA JUNICHI·Filed 2012·Granted Apr 1, 2014·4 cites·5 claims
- 1180US7954234B2Method of manufacturing a wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 7, 2011·10 cites·6 claims
- 1279US7582551B2Wiring substrate and wiring substrate manufacturing methodSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 1, 2009·8 cites·5 claims
- 1378US9247644B2Wiring board and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Jan 26, 2016·4 cites·10 claims
- 1477US10177012B2Wiring substrate and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2017·Granted Jan 8, 2019·2 cites·6 claims
- 1572US9089041B2Method of fabricating a wiring boardSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 21, 2015·2 cites·6 claims
- 1667US9006103B2Method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Apr 14, 2015·2 cites·9 claims
- 1766US8476536B2Wiring substrate and method for manufacturing the sameKANEKO KENTARO·Filed 2007·Granted Jul 2, 2013·2 cites·21 claims
- 1866US2025280498A1Interconnect substrate and method of making interconnect substrateSHINKO ELECTRIC IND CO·Filed 2025·Application pending·0 cites
- 1965US10117336B2Method of manufacturing a wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Oct 30, 2018·1 cites·9 claims
- 2060US8610287B2Wiring substrate and method of manufacturing the sameKANEKO KENTARO·Filed 2010·Granted Dec 17, 2013·1 cites·8 claims
- 2156US2025374704A1Interconnect substrate and method of making the sameSHINKO ELECTRIC IND CO·Filed 2025·Application pending·0 cites
- 2255US2010084163A1Wiring board and method of fabricating the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 2353US6007668ATab tape and method for producing sameSHINKO ELECTRIC IND CO·Filed 1997·Granted Dec 28, 1999·15 cites·11 claims
- 2453US2015206833A1Wiring substrate having columnar protruding partSHINKO ELECTRIC IND CO·Filed 2015·Application pending·0 cites
- 2552US9345143B2Method of fabricating a wiring boardSHINKO ELECTRIC IND CO·Filed 2015·Granted May 17, 2016·0 cites·6 claims
- 2652US9137896B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Sep 15, 2015·0 cites·3 claims
- 2746US2010032196A1Multilayer wiring board, semiconductor package and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 2844US2011290536A1Wiring substrateKANEKO KENTARO·Filed 2011·Application pending·0 cites
- 2942US9818702B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Nov 14, 2017·0 cites·20 claims
- 3039US2012006591A1Wiring Substrate and Method for Manufacturing Wiring SubstrateKANEKO KENTARO·Filed 2011·Application pending·0 cites
- 3138US5738928ATab tape and method for producing sameSHINKO ELECTRIC IND CO·Filed 1995·Granted Apr 14, 1998·8 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →