Inventor · disambiguated record
Min-Chung Cheng
Also filed as: CHENG MIN · CHENG MIN-CHUNG
23 granted patents·10 pending applications·94 citations·filing 2003–2025
94Inventor score
Files withNANYA TECHNOLOGY CORP16CHUNGHWA PICTURE TUBES LTD6ARCSOFT INC4UNITED MICROELECTRONICS CORP4HSU CHIA-CHANG1
Top patents by PatentIndex Score
33 records- 0196US11647622B2Semiconductor structure having fin structures and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted May 9, 2023·3 cites·14 claims
- 0292US8766319B2Semiconductor device with ultra thin silicide layerLAI KUO-CHIH·Filed 2012·Granted Jul 1, 2014·16 cites·2 claims
- 0386US11488961B2Semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2021·Granted Nov 1, 2022·2 cites·13 claims
- 0485US8845149B2Plant illumination apparatus and plant illumination systemCHUNGHWA PICTURE TUBES LTD·Filed 2013·Granted Sep 30, 2014·8 cites·10 claims
- 0582US8598033B1Method for forming a salicide layerUNITED MICROELECTRONICS CORP·Filed 2012·Granted Dec 3, 2013·6 cites·13 claims
- 0681US9125351B2Plant cultivation deviceCHUNGHWA PICTURE TUBES LTD·Filed 2013·Granted Sep 8, 2015·7 cites·11 claims
- 0781US7865014B2Video auto enhancing algorithmARCSOFT INC·Filed 2008·Granted Jan 4, 2011·7 cites·27 claims
- 0880US2025273570A1Wiring structure with conductive features having different critical dimensions, and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0978US9265205B2Multifunctional planting systemCHUNGHWA PICTURE TUBES LTD·Filed 2013·Granted Feb 23, 2016·5 cites·9 claims
- 1078US2025239519A1Method of manufacturing metal structure having funnel-shaped interconnectNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1175US11963345B2Semiconductor structure having fin structuresNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 16, 2024·0 cites·7 claims
- 1275US2024413006A1Method of manufacturing semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1374US2024047355A1Wiring structure with conductive features having different critical dimensions, and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1474US2024047352A1Semiconductor device having funnel-shaped interconnect and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1573US12267993B2Semiconductor structure having buried word linesNANYA TECHNOLOGY CORP·Filed 2023·Granted Apr 1, 2025·0 cites·9 claims
- 1673US7474785B2Video auto enhancing algorithmARCSOFT INC·Filed 2004·Granted Jan 6, 2009·12 cites·23 claims
- 1771US7809189B2Method for image separatingARCSOFT INC·Filed 2007·Granted Oct 5, 2010·8 cites·16 claims
- 1870US2024047354A1Wiring structure with conductive features having different critical dimensions, and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1970US2024047350A1Metal structure having funnel-shaped interconnect and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2068US12100615B2Method of manufacturing semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2021·Granted Sep 24, 2024·0 cites·12 claims
- 2166US8815738B2Salicide processHSU CHIA-CHANG·Filed 2012·Granted Aug 26, 2014·3 cites·12 claims
- 2263US12245416B2Semiconductor structure having buried word lines and method of manufacturing the sameNANYA TECHNOLOGY CORP·Filed 2021·Granted Mar 4, 2025·0 cites·16 claims
- 2361US11830812B2Semiconductor device with T-shaped landing pad structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Nov 28, 2023·0 cites·14 claims
- 2461US7519236B2Image retrievalARCSOFT INC·Filed 2003·Granted Apr 14, 2009·16 cites·17 claims
- 2560US9318338B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 19, 2016·1 cites·10 claims
- 2660US2025210419A1Bracing structure, semiconductor device with the same, and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2758US11839072B2Method for preparing semiconductor device with T-shaped landing pad structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Dec 5, 2023·0 cites·12 claims
- 2855US8993390B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 31, 2015·0 cites·16 claims
- 2954US2014215920A1Hydroponic apparatus and collecting device thereofCHUNGHWA PICTURE TUBES LTD·Filed 2013·Application pending·0 cites
- 3047US8709910B2Semiconductor processLIAO CHIN-I·Filed 2012·Granted Apr 29, 2014·0 cites·18 claims
- 3144US9685316B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 20, 2017·0 cites·8 claims
- 3240US2018329431A1Thermal image positioning system and positioning method thereofCHUNGHWA PICTURE TUBES LTD·Filed 2017·Application pending·0 cites
- 3339US9832941B2Hydroponic cultivation apparatusCHUNGHWA PICTURE TUBES LTD·Filed 2016·Granted Dec 5, 2017·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →