Inventor · disambiguated record
Tiffany Byrne
Also filed as: BYRNE TIFFANY · BYRNE TIFFANY A
6 granted patents·2 pending applications·44 citations·filing 2004–2010
82Inventor score
Top patents by PatentIndex Score
8 records- 0189US7279362B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2005·Granted Oct 9, 2007·18 cites·8 claims
- 0286US8193072B2Semiconductor wafer coat layers and methods thereforLI ERIC J·Filed 2010·Granted Jun 5, 2012·9 cites·9 claims
- 0379US7897486B2Semiconductor wafer coat layers and methods thereforINTEL CORP·Filed 2007·Granted Mar 1, 2011·7 cites·7 claims
- 0471US7291548B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2007·Granted Nov 6, 2007·5 cites·20 claims
- 0547US7494041B2In-situ alloyed solders, articles made thereby, and processes of making sameINTEL CORP·Filed 2004·Granted Feb 24, 2009·2 cites·15 claims
- 0647US7253088B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2004·Granted Aug 7, 2007·3 cites·12 claims
- 0744US2006067852A1Low melting-point solders, articles made thereby, and processes of making sameSUH DAEWOONG·Filed 2004·Application pending·0 cites
- 0838US2006060639A1Doped contact formationsBYRNE TIFFANY A·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →