Inventor · disambiguated record
Masashi Katsumata
Also filed as: KATSUMATA MASASHI
14 granted patents·1 pending application·153 citations·filing 1989–2019
91Inventor score
Files withTDK CORP15
Top patents by PatentIndex Score
15 records- 0195US7868464B2Multilayer substrate and manufacturing method thereofTDK CORP·Filed 2005·Granted Jan 11, 2011·40 cites·23 claims
- 0285US7368998B2Inductor element containing circuit board and power amplifier moduleTDK CORP·Filed 2006·Granted May 6, 2008·13 cites·9 claims
- 0375US6373714B1Surface mounting partTDK CORP·Filed 1999·Granted Apr 16, 2002·43 cites·11 claims
- 0469US4972191AWave absorber, and an anechoic chamber using the sameTDK CORP·Filed 1989·Granted Nov 20, 1990·30 cites·13 claims
- 0566US9153553B2IC embedded substrate and method of manufacturing the sameTDK CORP·Filed 2014·Granted Oct 6, 2015·2 cites·18 claims
- 0658US7120394B2Front-end module and communication terminalTDK CORP·Filed 2003·Granted Oct 10, 2006·5 cites·10 claims
- 0754US5852388AVoltage controlled oscillator and sensitivity adjustmentTDK CORP·Filed 1997·Granted Dec 22, 1998·12 cites·13 claims
- 0849US7176756B2Inductor element containing circuit board and power amplifier moduleTDK CORP·Filed 2004·Granted Feb 13, 2007·2 cites·8 claims
- 0945US7812444B2Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded thereinTDK CORP·Filed 2006·Granted Oct 12, 2010·0 cites·20 claims
- 1044US11682628B2Semiconductor IC-embedded substrate having heat dissipation structure and its manufacturing methodTDK CORP·Filed 2019·Granted Jun 20, 2023·0 cites·20 claims
- 1144US2008079146A1Semiconductor-embedded substrate and manufacturing method thereofTDK CORP·Filed 2007·Application pending·0 cites
- 1243US6144263AVoltage-controlled oscillator and method for adjusting frequency shift amount thereofTDK CORP·Filed 1999·Granted Nov 7, 2000·6 cites·16 claims
- 1342US10515898B2Circuit board incorporating semiconductor IC and manufacturing method thereofTDK CORP·Filed 2018·Granted Dec 24, 2019·0 cites·16 claims
- 1442US10225923B2Electronic circuit module and manufacturing method of the sameTDK CORP·Filed 2017·Granted Mar 5, 2019·0 cites·19 claims
- 1541US10741502B2Multilayer circuit boardTDK CORP·Filed 2018·Granted Aug 11, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →