Inventor · disambiguated record
Yuzhuo Li
Also filed as: LI YUZHUO
36 granted patents·26 pending applications·449 citations·filing 1999–2021
97Inventor score
Top patents by PatentIndex Score
62 records- 0190US6656241B1Silica-based slurryPPG IND OHIO INC·Filed 2001·Granted Dec 2, 2003·61 cites·29 claims
- 0290US6258721B1Diamond slurry for chemical-mechanical planarization of semiconductor wafersGEN ELECTRIC·Filed 1999·Granted Jul 10, 2001·113 cites·18 claims
- 0388US6242351B1Diamond slurry for chemical-mechanical planarization of semiconductor wafersGEN ELECTRIC·Filed 2000·Granted Jun 5, 2001·50 cites·33 claims
- 0486US7419519B2Engineered non-polymeric organic particles for chemical mechanical planarizationDYNEA CHEMICALS OY·Filed 2006·Granted Sep 2, 2008·23 cites·18 claims
- 0586US6620215B2Abrasive composition containing organic particles for chemical mechanical planarizationDYNEA CANADA LTD·Filed 2001·Granted Sep 16, 2003·65 cites·11 claims
- 0683US7279119B2Silica and silica-based slurryPPG IND OHIO INC·Filed 2003·Granted Oct 9, 2007·31 cites·19 claims
- 0782US7037351B2Non-polymeric organic particles for chemical mechanical planarizationDYNEA CHEMICALS OY·Filed 2003·Granted May 2, 2006·33 cites·19 claims
- 0880US8679980B2Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP processRAMAN VIJAY IMMANUEL·Filed 2010·Granted Mar 25, 2014·6 cites·24 claims
- 0977US10647900B2Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitorsBASF SE·Filed 2014·Granted May 12, 2020·3 cites·16 claims
- 1077US6508953B1Slurry for chemical-mechanical polishing copper damascene structuresFERRO CORP·Filed 2000·Granted Jan 21, 2003·18 cites·19 claims
- 1176US6660639B2Method of fabricating a copper damascene structureFERRO CORP·Filed 2002·Granted Dec 9, 2003·16 cites·19 claims
- 1275US9777192B2Chemical mechanical polishing (CMP) composition comprising a proteinBASF SE·Filed 2013·Granted Oct 3, 2017·3 cites·16 claims
- 1375US7166014B2Chemical mechanical planarization process control utilizing in-situ conditioning processTBW IND INC·Filed 2005·Granted Jan 23, 2007·6 cites·14 claims
- 1471US9487675B2Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivativesRAMAN VIJAY IMMANUEL·Filed 2011·Granted Nov 8, 2016·3 cites·11 claims
- 1571US8980750B2Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate saltBASF SE·Filed 2013·Granted Mar 17, 2015·2 cites·14 claims
- 1669US9458415B2Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acidBASF SE·Filed 2013·Granted Oct 4, 2016·2 cites·32 claims
- 1764US10392531B2Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this processRAMAN VIJAY IMMANUEL·Filed 2010·Granted Aug 27, 2019·2 cites·16 claims
- 1862US8597539B2Chemical mechanical polishing (CMP) polishing solution with enhanced performanceLI YUZHUO·Filed 2009·Granted Dec 3, 2013·2 cites·20 claims
- 1961US9070632B2Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layersRAMAN VIJAY IMMANUEL·Filed 2011·Granted Jun 30, 2015·1 cites·14 claims
- 2059US11168239B2Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitorsBASF SE·Filed 2020·Granted Nov 9, 2021·0 cites·17 claims
- 2157US8927429B2Chemical mechanical polishing (CMP) composition comprising a specific heteropolyacidSCHMITT CHRISTINE·Filed 2011·Granted Jan 6, 2015·1 cites·15 claims
- 2257US8684793B2Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarizationLI YUZHUO·Filed 2010·Granted Apr 1, 2014·1 cites·20 claims
- 2356US9443739B2Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or Si1-xGex material in the presence of a CMP composition comprising a specific organic compoundNOLLER BASTIAN MARTEN·Filed 2012·Granted Sep 13, 2016·2 cites·17 claims
- 2455US11751512B2Woody rootstock for efficient grafting of solanaceous vegetables and efficient grafting and seedling culture method thereofUNIV ZHEJIANG·Filed 2021·Granted Sep 12, 2023·0 cites·8 claims
- 2555US9255214B2Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particlesLAUTER MICHAEL·Filed 2010·Granted Feb 9, 2016·1 cites·19 claims
- 2653US9309448B2Abrasive articles, method for their preparation and method of their useKUJAT CHRISTOF·Filed 2011·Granted Apr 12, 2016·1 cites·23 claims
- 2753US6916428B2Photo-chemical remediation of Cu-CMP wastePERSEE CHEMICAL CO LTD·Filed 2003·Granted Jul 12, 2005·3 cites·8 claims
- 2852US2008090500A1Process for reducing dishing and erosion during chemical mechanical planarizationPPG IND OHIO INC·Filed 2007·Application pending·0 cites
- 2951US2010178768A1Controlling passivating film properties using colloidal particles, polyelectrolytes, and ionic additives for copper chemical mechanical planarizationBASF SE·Filed 2008·Application pending·0 cites
- 3051US2008034670A1Chemically modified chemical mechanical polishing padPPG IND OHIO INC·Filed 2007·Application pending·0 cites
- 3149US2009321390A1Chemical mechanical polishing of moisture sensitive surfaces and compositions thereofLI YUZHUO·Filed 2007·Application pending·0 cites
- 3249US2010059390A1METHOD AND APARATUS FOR ELECTROCHEMICAL MECHANICAL POLISHING NiP SUBSTRATESLI YUZHUO·Filed 2007·Application pending·0 cites
- 3347US2013005149A1Chemical-mechanical planarization of substrates containing copper, ruthenium, and tantalum layersBASF SE·Filed 2011·Application pending·0 cites
- 3447US2016035582A1Chemical-mechanical planarization of substrates containing copper, ruthenium, and tantalum layersBASF SE·Filed 2015·Application pending·0 cites
- 3547US2016280963A1Raspberry-type metal oxide nanostructures coated with ceo2 nanoparticles for chemical mechanical planarization (cmp)BASF SE·Filed 2016·Application pending·0 cites
- 3645US2007037491A1Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishingLI YUZHUO·Filed 2005·Application pending·0 cites
- 3743US9487674B2Chemical mechanical polishing (CMP) composition comprising a glycosideLI YUZHUO·Filed 2012·Granted Nov 8, 2016·0 cites·15 claims
- 3842US9005472B2Aqueous polishing agent and graft copolymers and their use in a process for polishing patterned and unstructured metal surfacesRAMAN VIJAY IMMANUEL·Filed 2011·Granted Apr 14, 2015·0 cites·13 claims
- 3942US2009047787A1Slurry containing multi-oxidizer and nano-abrasives for tungsten CMPLI YUZHUO·Filed 2008·Application pending·0 cites
- 4042US2004077295A1Process for reducing dishing and erosion during chemical mechanical planarizationFiled 2003·Application pending·0 cites
- 4142US2014011362A1Chemical mechanical polishing (cmp) composition comprising a non-ionic surfactant and an aromatic compound comprising at least one acid groupBASF SE·Filed 2013·Application pending·0 cites
- 4241US9416298B2Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactantBASF SE·Filed 2013·Granted Aug 16, 2016·0 cites·12 claims
- 4341US2016160083A1Cmp composition comprising abrasive particles containing ceriaBASF SE·Filed 2014·Application pending·0 cites
- 4438US10214663B2Chemical-mechanical polishing composition comprising organic/inorganic composite particlesBASF SE·Filed 2015·Granted Feb 26, 2019·0 cites·20 claims
- 4538US9263296B2Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitorsNOLLER BASTIAN·Filed 2012·Granted Feb 16, 2016·0 cites·25 claims
- 4637US9028708B2Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this processRAMAN VIJAY IMMANUEL·Filed 2010·Granted May 12, 2015·0 cites·18 claims
- 4737US2012077419A1Raspberry-type metal oxide nanostructures coated with ceo2 nanoparticles for chemical mechanical planarization (cmp)ZHANG ZHIHUA·Filed 2010·Application pending·0 cites
- 4835US10407594B2Chemical mechanical polishing (CMP) composition comprising a polymeric polyamineNOLLER BASTIAN MARTEN·Filed 2012·Granted Sep 10, 2019·0 cites·12 claims
- 4934US8747687B2Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfacesRAMAN VIJAY IMMANUEL·Filed 2010·Granted Jun 10, 2014·0 cites·20 claims
- 5034US2017161759A1Automated and assisted generation of surveysIBM·Filed 2015·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →