Inventor · disambiguated record
Hideki Naruoka
Also filed as: NARUOKA HIDEKI
13 granted patents·2 pending applications·159 citations·filing 1998–2014
92Inventor score
Files withMITSUBISHI ELECTRIC CORP7RENESAS TECH CORP4SOITEC SILICON ON INSULATOR2KONDO TAKESHI1MITSUBISHI MATERIAL SILICON1
Top patents by PatentIndex Score
15 records- 0179US6902988B2Method for treating substrates for microelectronics and substrates obtained by said methodSOITEC SILICON ON INSULATOR·Filed 2002·Granted Jun 7, 2005·20 cites·25 claims
- 0275US6872979B2Semiconductor substrate with stacked oxide and SOI layers with a molten or epitaxial layer formed on an edge of the stacked layersRENESAS TECH CORP·Filed 2003·Granted Mar 29, 2005·13 cites·4 claims
- 0372US7235427B2Method for treating substrates for microelectronics and substrates obtained by said methodSOITEC SILICON ON INSULATOR·Filed 2005·Granted Jun 26, 2007·3 cites·15 claims
- 0472US6563172B2Semiconductor substrate processing methodMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 13, 2003·12 cites·5 claims
- 0572US6300147B1Method of inspecting semiconductor substrateMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 9, 2001·15 cites·7 claims
- 0670US6844242B2Method of manufacturing SOI waferRENESAS TECH CORP·Filed 2002·Granted Jan 18, 2005·18 cites·11 claims
- 0768US6252294B1Semiconductor device and semiconductor storage deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 26, 2001·34 cites·20 claims
- 0865US6232201B1Semiconductor substrate processing methodMITSUBISHI ELECTRIC CORP·Filed 1998·Granted May 15, 2001·24 cites·14 claims
- 0963US6646306B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 11, 2003·8 cites·10 claims
- 1062US6673640B2Method of manufacturing semiconductor device for evaluation capable of evaluating crystal defect using in-line test by avoiding using preferential etching processRENESAS TECH CORP·Filed 2002·Granted Jan 6, 2004·8 cites·11 claims
- 1154US6914307B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jul 5, 2005·4 cites·8 claims
- 1247US2005212056A1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 1346US9211626B2Semiconductor device and grinding method of semiconductor deviceKONDO TAKESHI·Filed 2014·Granted Dec 15, 2015·0 cites·5 claims
- 1438US2004122624A1Semiconductor wafer inspecting methodRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 1531US6558990B1SOI substrate, method of manufacture thereof, and semiconductor device using SOI substrateMITSUBISHI MATERIAL SILICON·Filed 2000·Granted May 6, 2003·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →