Inventor · disambiguated record
Yen-Huey Hsu
Also filed as: HSU YEN-HUEY
4 granted patents·9 pending applications·43 citations·filing 1999–2018
68Inventor score
Top patents by PatentIndex Score
13 records- 0166US6133408APolyimide resin for cast on copper laminate and laminate produced therefromWIREX CORP·Filed 1999·Granted Oct 17, 2000·42 cites·16 claims
- 0251US9234085B2Polyimide film and polyimide laminate thereofMORTECH CORP·Filed 2013·Granted Jan 12, 2016·1 cites·26 claims
- 0350US2013280512A1Polyimide filmMORTECH CORP·Filed 2013·Application pending·0 cites
- 0449US8691131B2Polyimide filmHSU YEN-HUEY·Filed 2012·Granted Apr 8, 2014·0 cites·15 claims
- 0548US2009061243A1Metal clad laminate and the manufacturing method thereofMORTECH CORP·Filed 2008·Application pending·0 cites
- 0648US2011146905A1Method for forming patterned layer on substrate structureHON HAI PREC IND CO LTD·Filed 2011·Application pending·0 cites
- 0747US2007164400A1Substrate structure and method for forming patterned layer on substrate structureICF TECHNOLOGY CO LTD·Filed 2006·Application pending·0 cites
- 0844US2019023576A1Composite material containing artificial graphite, graphite sheet and manufacturing method of manufacturing the sameMORTECH CORP·Filed 2018·Application pending·0 cites
- 0942US2010143706A1Polyimide laminate and a method of fabricating the sameMORTECH CORP·Filed 2009·Application pending·0 cites
- 1041US2007146406A1Method for manufacturing patterned thin-film layerICF TECHNOLOGY CO LTD·Filed 2006·Application pending·0 cites
- 1140US9499664B2Polyimide polymer, polyimide film having the same and polyimide laminate having the sameMORTECH CORP·Filed 2015·Granted Nov 22, 2016·0 cites·17 claims
- 1237US2007120931A1Method for manufacturing substrate having thin film pattern layerICF TECHNOLOGY CO LTD·Filed 2006·Application pending·0 cites
- 1335US2013273254A1Polymide film and method for manufacturing the sameHSU YEN-HUEY·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →