Inventor · disambiguated record
Yohei Uchida
Also filed as: UCHIDA YOHEI
30 granted patents·9 pending applications·190 citations·filing 2002–2025
95Inventor score
Top patents by PatentIndex Score
39 records- 0198US11501995B2Plasma processing apparatus and mounting table thereofTOKYO ELECTRON LTD·Filed 2020·Granted Nov 15, 2022·7 cites·17 claims
- 0296US12293937B2Plasma processing apparatus and mounting table thereofTOKYO ELECTRON LTD·Filed 2022·Granted May 6, 2025·2 cites·15 claims
- 0392US7239784B2Optical fiber, method for manufacturing same and optical transmission channelFURUKAWA ELECTRIC CO LTD·Filed 2006·Granted Jul 3, 2007·50 cites·4 claims
- 0487US7095940B2Optical fiber, method for manufacturing same and optical transmission channelFURUKAWA ELECTRIC CO LTD·Filed 2003·Granted Aug 22, 2006·41 cites·8 claims
- 0586USD992614SFocus ringTOKYO ELECTRON LTD·Filed 2019·Granted Jul 18, 2023·24 cites·1 claims
- 0685US11032899B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Jun 8, 2021·4 cites·9 claims
- 0783US9887108B2Gas supply device and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Feb 6, 2018·5 cites·5 claims
- 0882USD992615SFocus ringTOKYO ELECTRON LTD·Filed 2019·Granted Jul 18, 2023·25 cites·1 claims
- 0981US12046457B2Electrostatic chuck, focus ring, support base, plasma processing apparatus, and plasma processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Jul 23, 2024·2 cites·16 claims
- 1080US10199241B2Gas supply device and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted Feb 5, 2019·2 cites·7 claims
- 1179US2025329519A1Mounting base, substrate processing device, edge ring, and edge ring transfer methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1279US2025233008A1Plasma processing apparatus and mounting table thereofTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1376US10886108B2Power feed structure and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Jan 5, 2021·1 cites·8 claims
- 1475US11004822B2Wire clamp apparatus calibration method and wire bonding apparatusSHINKAWA KK·Filed 2017·Granted May 11, 2021·4 cites·20 claims
- 1575US2024347322A1Electrostatic chuck, focus ring, support base, plasma processing apparatus, and plasma processing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1672US11495445B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 8, 2022·1 cites·19 claims
- 1771US9169558B2Fluid control apparatusHIROSE JUN·Filed 2009·Granted Oct 27, 2015·5 cites·6 claims
- 1868US11942357B2Workpiece placement apparatus and processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Mar 26, 2024·0 cites·10 claims
- 1968US11825589B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2021·Granted Nov 21, 2023·0 cites·22 claims
- 2067US8770214B2Gas mixture supplying method and apparatusUCHIDA YOHEI·Filed 2009·Granted Jul 8, 2014·4 cites·7 claims
- 2164US9145605B2Thin-film forming method and thin-film forming apparatusMASUDA TAKESHI·Filed 2011·Granted Sep 29, 2015·2 cites·8 claims
- 2263US6665482B2Optical fiber and optical transmission lineFURUKAWA ELECTRIC CO LTD·Filed 2002·Granted Dec 16, 2003·9 cites·4 claims
- 2362US8883632B2Manufacturing method and manufacturing apparatus of deviceULVAC INC·Filed 2013·Granted Nov 11, 2014·2 cites·4 claims
- 2461US2025043188A1Foaming methodKAO CORP·Filed 2022·Application pending·0 cites
- 2557US2021327688A1Mounting base, substrate processing device, edge ring, and edge ring transfer methodTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 2654US11717912B2Capillary guide device and wire bonding apparatusSHINKAWA KK·Filed 2020·Granted Aug 8, 2023·0 cites·5 claims
- 2754US11410871B2Workpiece placement apparatus and processing apparatusTOKYO ELECTRON LTD·Filed 2019·Granted Aug 9, 2022·0 cites·9 claims
- 2851US11600471B2Substrate support, plasma processing apparatus, and focus ringTOKYO ELECTRON LTD·Filed 2019·Granted Mar 7, 2023·0 cites·16 claims
- 2951US10865368B2Rinse agent composition for silicon wafersKAO CORP·Filed 2017·Granted Dec 15, 2020·0 cites·6 claims
- 3049US11984300B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted May 14, 2024·0 cites·4 claims
- 3149US8276891B2Gas mixture supplying method and apparatusUCHIDA YOHEI·Filed 2009·Granted Oct 2, 2012·0 cites·14 claims
- 3245US11795346B2Polishing liquid composition for silicon oxide filmKAO CORP·Filed 2018·Granted Oct 24, 2023·0 cites·15 claims
- 3344US9209060B2Mounting table structure and method of holding focus ringTOKYO ELECTRON LTD·Filed 2013·Granted Dec 8, 2015·0 cites·6 claims
- 3443US10847348B2Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 24, 2020·0 cites·17 claims
- 3539US8905747B2Bur removing apparatusHANGAI TOMOHIRO·Filed 2008·Granted Dec 9, 2014·0 cites·4 claims
- 3639US2019249122A1Rinsing agent composition for silicon wafersKAO CORP·Filed 2017·Application pending·0 cites
- 3737US2004223714A1Optical fiber and optical transmission lineFiled 2003·Application pending·0 cites
- 3836US2018182635A1Focus ring and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2017·Application pending·0 cites
- 3933US2013216710A1Thin film forming method and thin film forming apparatusMASUDA TAKESHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →