Inventor · disambiguated record
Taeje Cho
Also filed as: CHO TAEJE
22 granted patents·8 pending applications·260 citations·filing 2010–2024
95Inventor score
Top patents by PatentIndex Score
30 records- 0197US8802495B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 12, 2014·87 cites·21 claims
- 0294US9461029B2Semiconductor packages and methods for fabricating the sameJANG HYE-YOUNG·Filed 2015·Granted Oct 4, 2016·17 cites·20 claims
- 0393US9508704B2Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 29, 2016·11 cites·14 claims
- 0492US8884416B2Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chipLEE GO EUN·Filed 2010·Granted Nov 11, 2014·51 cites·26 claims
- 0589US10157766B2Method of fabricating a semiconductor deviceKANG UN BYOUNG·Filed 2014·Granted Dec 18, 2018·13 cites·19 claims
- 0688US8399987B2Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layersKWON WOONSEONG·Filed 2010·Granted Mar 19, 2013·19 cites·41 claims
- 0787US9905550B2Semiconductor package and method of fabricating the sameHAN SANG UK·Filed 2015·Granted Feb 27, 2018·7 cites·20 claims
- 0886US9245771B2Semiconductor packages having through electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·8 cites·30 claims
- 0986US9177942B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 3, 2015·9 cites·13 claims
- 1085US9024434B2Semiconductor packagesIM YUNHYEOK·Filed 2012·Granted May 5, 2015·8 cites·16 claims
- 1184US10186500B2Semiconductor package and method of fabricating the sameRYU SEUNG KWAN·Filed 2016·Granted Jan 22, 2019·6 cites·16 claims
- 1282US10121731B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 6, 2018·4 cites·19 claims
- 1381US9875992B2Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the sameHEO JUNYEONG·Filed 2015·Granted Jan 23, 2018·6 cites·15 claims
- 1476US10192855B2Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting lineSEO SUNKYOUNG·Filed 2015·Granted Jan 29, 2019·4 cites·20 claims
- 1574US12237319B2Stacked-chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 25, 2025·0 cites·20 claims
- 1672US8558371B2Method for wafer level package and semiconductor device fabricated using the sameHONG JISUN·Filed 2011·Granted Oct 15, 2013·5 cites·16 claims
- 1770US9275903B2Method of manufacturing semiconductor device substrate with crystal structure reformation regionsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 1, 2016·2 cites·19 claims
- 1868US9793165B2Methods of fabricating semiconductor devicesJEONG SEYOUNG·Filed 2012·Granted Oct 17, 2017·3 cites·10 claims
- 1966US11923351B2Stacked-chip packages having through viasSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 2054US10734367B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·19 claims
- 2147US9355961B2Semiconductor devices having through-electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 31, 2016·0 cites·21 claims
- 2246US2016372447A1Semiconductor packages and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 2342US2014141569A1Semiconductor devices having through-via and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2442US2013330925A1Methods of treating a device-substrate and support-substrates used thereinSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2540US2015171028A1Semiconductor package and method of fabricating the sameJO CHAJEA·Filed 2014·Application pending·0 cites
- 2639US2012175782A1Semiconductor package and method of manufacturing the sameIM YUNHYEOK·Filed 2012·Application pending·0 cites
- 2738US2012119346A1Semiconductor package and method of forming the sameIM YUNHYEOK·Filed 2011·Application pending·0 cites
- 2836US9646895B2Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 9, 2017·0 cites·2 claims
- 2935US2016314996A1Substrate treating apparatus and a method for treating a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3028US2016148888A1Semiconductor devices and methods for fabricating the sameRYU SEUNG-KWAN·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →