Inventor · disambiguated record
Shawn D. Lyonsmith
Also filed as: LYONSMITH SHAWN · LYONSMITH SHAWN D
17 granted patents·2 pending applications·60 citations·filing 2002–2024
91Inventor score
Top patents by PatentIndex Score
19 records- 0191US8026501B2Method of removing or deposting material on a surface including material selected to decorate a particle on the surface for imagingMICRON TECHNOLOGY INC·Filed 2010·Granted Sep 27, 2011·10 cites·30 claims
- 0289US7791055B2Electron induced chemical etching/deposition for enhanced detection of surface defectsMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 7, 2010·14 cites·18 claims
- 0380US6716719B2Method of forming biasable isolation regions using epitaxially grown silicon between the isolation regionsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 6, 2004·25 cites·35 claims
- 0479US12462370B2System for predicting properties of structures, imager system, and related methodsMICRON TECHNOLOGY INC·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0578US10672500B2Non-contact measurement of memory cell threshold voltageMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 2, 2020·2 cites·20 claims
- 0677US2025071996A1Memory device including multiple decks of memory cells and pillars extending through the decksLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 0776US10650891B2Non-contact electron beam probing techniques and related structuresMICRON TECHNOLOGY INC·Filed 2019·Granted May 12, 2020·3 cites·17 claims
- 0873US12167599B2Memory device including multiple decks of memory cells and pillars extending through the decksLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Dec 10, 2024·0 cites·17 claims
- 0973US11508746B2Semiconductor device having a stack of data lines with conductive structures on both sides thereofMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 22, 2022·1 cites·10 claims
- 1072US12513903B2Method for manufacturing a memory structure having stacked data lines and conductive structures on sides thereofLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Dec 30, 2025·0 cites·19 claims
- 1169US10403359B2Non-contact electron beam probing techniques and related structuresMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 3, 2019·2 cites·5 claims
- 1267US11869178B2System for predicting properties of structures, imager system, and related methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 9, 2024·0 cites·18 claims
- 1365US11532638B2Memory device including multiple decks of memory cells and pillars extending through the decksMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 20, 2022·0 cites·27 claims
- 1456US10872403B2System for predicting properties of structures, imager system, and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 1555US10381101B2Non-contact measurement of memory cell threshold voltageMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 13, 2019·0 cites·3 claims
- 1651US6919612B2Biasable isolation regions using epitaxially grown silicon between the isolation regionsMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 19, 2005·3 cites·25 claims
- 1747US8563435B2Method of reducing damage to an electron beam inspected semiconductor substrate, and methods of inspecting a semiconductor substrateDAYCOCK DAVID A·Filed 2012·Granted Oct 22, 2013·0 cites·18 claims
- 1845US8334209B2Method of reducing electron beam damage on post W-CMP wafersDAYCOCK DAVID A·Filed 2006·Granted Dec 18, 2012·0 cites·20 claims
- 1932US2012007073A1Semiconductor Wafer Constructions, And Methods For Quality Testing Material Removal Procedures During Semiconductor Fabrication ProcessesMEHTA ANJUM·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →