Inventor · disambiguated record
Ryoichi Kimizuka
Also filed as: KIMIZUKA RYOICHI
13 granted patents·16 pending applications·356 citations·filing 1986–2015
93Inventor score
Top patents by PatentIndex Score
29 records- 0196US6709563B2Copper-plating liquid, plating method and plating apparatusEBARA CORP·Filed 2001·Granted Mar 23, 2004·68 cites·57 claims
- 0295US6800188B2Copper plating bath and plating method for substrate using the copper plating bathEBARA UDYLITE KK·Filed 2002·Granted Oct 5, 2004·81 cites·33 claims
- 0395US6638411B1Method and apparatus for plating substrate with copperEBARA CORP·Filed 2000·Granted Oct 28, 2003·46 cites·13 claims
- 0492US6518182B1Via-filling processEBARA UDYLITE KK·Filed 2000·Granted Feb 11, 2003·40 cites·15 claims
- 0588US6627066B1Method of measuring the concentration of a leveler in a plating liquidEBARA CORP·Filed 2000·Granted Sep 30, 2003·22 cites·4 claims
- 0681US6517894B1Method for plating a first layer on a substrate and a second layer on the first layerEBARA CORP·Filed 1999·Granted Feb 11, 2003·49 cites·125 claims
- 0773US6811658B2Apparatus for forming interconnectsEBARA CORP·Filed 2001·Granted Nov 2, 2004·14 cites·20 claims
- 0866US2008264798A1Copper Plating Bath and Plating MethodEBARA CORP·Filed 2008·Application pending·0 cites
- 0963US6908534B2Substrate plating method and apparatusEBARA CORP·Filed 2001·Granted Jun 21, 2005·7 cites·12 claims
- 1063US2007102285A1Apparatus for managing a plating liquidISAYAMA YASUSHI·Filed 2006·Application pending·0 cites
- 1159US4699696AZinc-nickel alloy electrolyte and processOMI INT CORP·Filed 1986·Granted Oct 13, 1987·12 cites·33 claims
- 1257US7553400B2Plating apparatus and plating methodEBARA CORP·Filed 2004·Granted Jun 30, 2009·6 cites·16 claims
- 1357US7172683B2Method of managing a plating liquid used in a plating apparatusEBARA CORP·Filed 2003·Granted Feb 6, 2007·1 cites·4 claims
- 1452US2005072683A1Copper plating bath and plating methodEBARA CORP·Filed 2004·Application pending·0 cites
- 1551US2004050711A1Method and apparatus for plating substrate with copperFiled 2003·Application pending·0 cites
- 1649US2005126919A1Plating method, plating apparatus and a method of forming fine circuit wiringFiled 2004·Application pending·0 cites
- 1749US2004060825A1Copper-plating liquid, plating method and plating apparatusFiled 2003·Application pending·0 cites
- 1848US2006144714A1Substrate plating method and apparatusHONGO AKIHISA·Filed 2006·Application pending·0 cites
- 1947US2008087549A1Additive For Copper Plating And Process For Producing Electronic Circiut Substrate TherewithEBARA UDYLITE KK·Filed 2004·Application pending·0 cites
- 2045US7033463B1Substrate plating method and apparatusEBARA CORP·Filed 1999·Granted Apr 25, 2006·10 cites·14 claims
- 2142US2005098439A1Substrate plating method and apparatusFiled 2004·Application pending·0 cites
- 2241US2004200728A1Method and apparatus for forming interconnects, and polishing liquid and polishing methodFiled 2004·Application pending·0 cites
- 2338US2004154931A1Polishing liquid, polishing method and polishing apparatusFiled 2003·Application pending·0 cites
- 2438US2005045486A1Plating method and plating solutionFiled 2004·Application pending·0 cites
- 2538US2003186540A1Method and apparatus for forming fine circuit interconnectsFiled 2003·Application pending·0 cites
- 2637US2005282384A1Method for forming protective film and electroless plating bathNAWAFUNE HIDEMI·Filed 2004·Application pending·0 cites
- 2735US2004022940A1Cooper-plating solution, plating method and plating apparatusFiled 2002·Application pending·0 cites
- 2830US2018298515A1Method for managing copper sulfate plating solutionJCU CORP·Filed 2015·Application pending·0 cites
- 2924US9321741B2Copper plating bath containing a tertiary amine compound and use thereofYASUDA HIROKI·Filed 2010·Granted Apr 26, 2016·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →