Inventor · disambiguated record
Yoshiharu Fukushima
Also filed as: FUKUSHIMA YOSHIHARU
15 granted patents·2 pending applications·97 citations·filing 1998–2018
92Inventor score
Files withRENESAS ELECTRONICS CORP7HITACHI HIGH TECH INSTR CO LTD4SANYO ELECTRIC CO3BETSUI TAKAFUMI1HITACHI HIGH TECH INSTR COMPAN1
Top patents by PatentIndex Score
17 records- 0181US6199272B1Electronic component- mounting apparatus and component-feeding device thereforSANYO ELECTRIC CO·Filed 1998·Granted Mar 13, 2001·43 cites·18 claims
- 0280US7581310B2Electronic component mounting apparatusHITACHI HIGH TECH INSTR CO LTD·Filed 2005·Granted Sep 1, 2009·9 cites·6 claims
- 0377US8898613B2Data processing deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 25, 2014·3 cites·20 claims
- 0475US8386992B2Data processing deviceRENESAS ELECTRONICS CORP·Filed 2011·Granted Feb 26, 2013·3 cites·5 claims
- 0575US6427320B1Electronic component-mounting apparatus and component-feeding device thereforSANYO ELECTRIC CO·Filed 2000·Granted Aug 6, 2002·17 cites·7 claims
- 0672US9530457B2Data processing deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Dec 27, 2016·2 cites·6 claims
- 0768US7721424B2Electronic component mounting methodHITACHI HIGH TECH INSTR CO LTD·Filed 2006·Granted May 25, 2010·3 cites·1 claims
- 0864US10726878B2Data processing deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 28, 2020·0 cites·1 claims
- 0962US8091061B2Microcomputer having memory interface circuits and memory devices on a module boardBETSUI TAKAFUMI·Filed 2006·Granted Jan 3, 2012·3 cites·8 claims
- 1056US8099860B2Electronic component mounting apparatusWATANABE AKIO·Filed 2008·Granted Jan 24, 2012·2 cites·5 claims
- 1154US6796022B2Electronic component mounting apparatusSANYO ELECTRIC CO·Filed 2002·Granted Sep 28, 2004·6 cites·8 claims
- 1253US9792959B2Data processing deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·0 cites·14 claims
- 1353US6986195B2Electronic component mounting apparatusHITACHI HIGH TECH INSTR COMPAN·Filed 2002·Granted Jan 17, 2006·6 cites·2 claims
- 1451US10020028B2Data processing deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 10, 2018·0 cites·16 claims
- 1550US8694949B2Data processing deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 8, 2014·0 cites·13 claims
- 1643US2007094868A1Electronic component mounting apparatusHITACHI HIGH TECH INSTR CO LTD·Filed 2006·Application pending·0 cites
- 1743US2007074387A1Electronic component mounting apparatusHITACHI HIGH TECH INSTR CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →