Inventor · disambiguated record
Kenji Hinode
Also filed as: HINODE KENJI
20 granted patents·2 pending applications·693 citations·filing 1987–2010
96Inventor score
Files withHITACHI LTD12RENESAS TECH CORP5INT SUPERCONDUCTIVITY TECH1OHASHI NAOFUMI1RENESAS ELECTRONICS CORP1
Top patents by PatentIndex Score
22 records- 0198US6117775APolishing methodHITACHI LTD·Filed 1998·Granted Sep 12, 2000·254 cites·50 claims
- 0295US7947596B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2006·Granted May 24, 2011·36 cites·8 claims
- 0395US4897709ATitanium nitride film in contact hole with large aspect ratioHITACHI LTD·Filed 1988·Granted Jan 30, 1990·151 cites·12 claims
- 0491US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 0589US6596638B1Polishing methodHITACHI LTD·Filed 2000·Granted Jul 22, 2003·33 cites·41 claims
- 0685US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 0785US4887146ASemiconductor deviceHITACHI LTD·Filed 1987·Granted Dec 12, 1989·47 cites·17 claims
- 0884US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 0984US6358838B2Semiconductor device and process for producing the sameHITACHI LTD·Filed 2001·Granted Mar 19, 2002·27 cites·23 claims
- 1082US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 1178US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 1275US6680541B2Semiconductor device and process for producing the sameHITACHI LTD·Filed 2002·Granted Jan 20, 2004·15 cites·8 claims
- 1374US7122900B2Semiconductor device and method manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Oct 17, 2006·18 cites·3 claims
- 1473US7279425B2Polishing methodHITACHI LTD·Filed 2006·Granted Oct 9, 2007·2 cites·27 claims
- 1571US6800557B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Oct 5, 2004·8 cites·5 claims
- 1660US7132367B2Polishing methodHITACHI LTD·Filed 2003·Granted Nov 7, 2006·4 cites·58 claims
- 1756US7563716B2Polishing methodRENESAS TECH CORP·Filed 2007·Granted Jul 21, 2009·0 cites·5 claims
- 1854US7081417B2Manufacturing method for electronic device and multiple layer circuits thereofINT SUPERCONDUCTIVITY TECH·Filed 2004·Granted Jul 25, 2006·5 cites·11 claims
- 1951US6864584B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Mar 8, 2005·4 cites·20 claims
- 2049US8129275B2Process for manufacturing semiconductor integrated circuit deviceOHASHI NAOFUMI·Filed 2010·Granted Mar 6, 2012·0 cites·15 claims
- 2145US2004152298A1Process for manufacturing semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 2240US2004229468A1Polishing methodFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →